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Thermal Test Vehicle (TTV) Product
Thermal Test Vehicles (TTV) & Thermal Test Emulators (TTE) — Advanced Cooling Validation for AI & HPC
As AI processors continue pushing power density boundaries, thermal validation has become a critical part of cooling system development. KLC offers a complete line of Thermal Test Vehicles (TTVs) and Thermal Test Emulators (TTEs) designed for chip-level, board-level, and system-level thermal validation.
Driven by next-generation AI servers, HPC platforms, GPU accelerators, and automotive ADAS processors, engineers must validate cold plates, liquid cooling systems, CDUs, and advanced thermal architectures before production silicon becomes available.
👉 Explore smarter cooling, engineered for the future of computing — info@ptc-heater.com.tw
How to Select the Right Thermal Test Vehicle
Different thermal validation requirements correspond to different TTV solutions. Use the guide below to find the right product.
| Application | Recommended Product | Typical Validation Scenario |
| AI Server Cold Plate Validation | Super High-Power TTV | Cold Plate Thermal Resistance Testing |
| AI GPU Thermal Simulation | Thin Plate TTV | GPU Package Thermal Simulation |
| GPU Hotspot Analysis | Multi-Zone TTV | Localized Hotspot Validation |
| AI Accelerator Cooling Validation | Super High-Power TTV for AI Accelerator | AI Accelerator Thermal Performance Testing |
| CDU Validation | Super High-Power TTV | Cooling Distribution Evaluation |
| Rack-Level Cooling Test | TTE | Rack-Level Thermal Validation |
| Two-Phase Cooling Validation | Multi-Zone TTV | Phase-Change Cooling Analysis |
Explore KLC Thermal Test Vehicle (TTV) Solutions
TTV Module Types (High Power Density Simulation — up to 500 W/cm² and above)
Choose the right thermal test solution based on your application requirements.
Thin Plate TTV (Thermal Test Vehicle)
Standard thin-plate thermal test vehicle, suitable for space-constrained or standard power density thermal testing.
- Dimensions: 30 × 30 mm – 80 × 80 mm
- Voltage: 12V – 600V
- See full specifications for more sizes and configurations.
Super High-Power TTV for OAM
Ultra-thin TTV with high thermal conductivity copper block design. Supports higher maximum current and total power.
- Dimensions: 30 × 30 mm – 80 × 80 mm
- Voltage: 12V – 600V
See full specifications for more sizes and configurations.
Super High-Power TTV with Heatsink (Custom)
Compatible with custom heatsinks / cold plates and cooling solutions for real-world thermal flow testing.
Multi-Zone Power TTV (Thermal Test Vehicle)
Multiple independently controlled heating zones to simulate localized chip hotspot distribution.
Server Rack Thermal Test Emulator (TTE)
Rack-level thermal test platform composed of multiple TTVs. Supports up to 300,000W for server cabinet cooling validation and immersion cooling testing.
Why Choose KLC Thermal Test Vehicles?
- Precisely simulates real chip and rack heat load behavior
- Reduces thermal design risk and accelerates product development cycles
- Customizable voltage / current / dimensions for flexible applications
- Single-zone TTV: uniform heating simulation
- Multi-zone TTV: localized hotspot simulation with independent zone control
- Ultra-thin TTV: supports high power density testing
Typical Application Scenarios
- AI Server Cold Plate Validation: Validate cold plate heat dissipation under various flow rates, temperatures, and thermal loads. Optimize microchannel design and improve overall thermal efficiency.
- AI GPU and AI Accelerator Thermal Simulation: Simulate actual thermal loads of AI GPUs, HPC chips, and accelerators. Validate thermal management performance of heatsinks, cold plates, and liquid cooling systems.
- Multi-Zone Hotspot Analysis: Use Multi-Zone TTV to simulate heat generation patterns across different chip regions, helping analyze localized overheating and optimize thermal design.
- CDU Cooling Capacity Validation: Evaluate cooling efficiency and system stability of Cooling Distribution Units under varying flow rates and thermal loads.
- Two-Phase Cooling Testing: Simulate high heat flux conditions to validate phase-change cooling system performance and reliability.
- Rack-Level Thermal Management Validation: Use Thermal Test Emulator (TTE) to build a system-level thermal environment and validate overall rack and data center cooling architecture.
- Semiconductor packaging and IC design validation
| Application Scenario | Product | Description |
|---|---|---|
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Multi-Zone Power TTV (Thermal Test Vehicle) on KLC TTV 2.0 | Micro-channel cold plate & direct-to-chip cooling testing / thermal validation for HPC chips |
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High-Power Thermal Test Chip | High-performance computing chip thermal testing & cooling validation |
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Server Rack Thermal Test Emulator (TTE) | Server rack thermal management and cooling system testing |
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Super High-Power TTV (OAM) | OAM cold plate thermal resistance testing |
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Super High-Power TTV | Thermal component cooling performance testing |
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Super High-Power TTV | Heatsink fin thermal performance testing |
Compare KLC TTV Solutions
| Product | Best For | Key Feature |
| Thin Plate TTV | GPU Thermal Simulation | Ultra-Thin Structure |
| Multi-Zone TTV | Hotspot Analysis | Independent Heating Zones |
| Super High-Power TTV | Cold Plate Validation | Up to 500 W/cm² |
| Super High-Power TTV for OAM | OAM Cooling Validation | OAM Form Factor |
| TTE | Rack-Level Testing | System-Level Validation |
Available Power–Voltage Configurations
Thin Plate TTV (Thermal Test Vehicle)
For thermal testing with spatial constraints or standard power density requirements.
- Dimensions: 30 × 30 mm – 80 × 80 mm
- Voltage: 12V – 600V
- Max Power: Ex. 50 × 50 mm: Max. 1,600W | 80 × 80 mm: Max. 4,200W
Super High-Power Thermal Test Vehicle (TTV)
Supports higher current and total power.
- Dimensions: 30 × 30 mm – 80 × 80 mm
- Voltage: 12V – 600V
- Max Power: Ex. 50 × 50 mm: Max. 5,000W | 80 × 80 mm: Max. 12,800W
For more sizes and power configurations, please consult the complete specifications.
Get the specification sheet Now!
Frequently Asked Questions (FAQs)
Q1. Which TTV is suitable for AI server cold plate validation?
Super High-Power TTV is recommended for high heat flux and cold plate thermal performance testing.
Q2. Which TTV is suitable for GPU hotspot simulation?
Multi-Zone TTV can reproduce localized hotspot conditions through independently controlled heating zones.
Q3. Can KLC provide custom TTV designs?
Yes. KLC supports customized dimensions, power levels, heating patterns, sensor integration, and mounting configurations.
Need Help Selecting the Right Thermal Test Vehicle?
Whether you are validating an AI server cold plate, liquid cooling architecture, CDU, or two-phase cooling system, KLC’s engineering team can recommend the most suitable TTV solution for your project.
Request Technical Consultation or Request Datasheet, contact: info@ptc-heater.com.tw
High-Power Thermal Test Emulator (TTE)-Thermal Test Vehicle (TTV)
High-Power Thermal Test Vehicle (TTV)- Thermal Simulation Module for AI Chips
Multi-Zone Power TTV (Thermal Test Vehicle) | KLC TTV 2.0
Super High-Power Thermal Test Vehicle (TTV) with Bakelite Base
Super High-Power Thermal Test Vehicle (TTV)- Heat Simulation Module for AI Accelerator | KLC TTV 2.0
Super High-Power TTV with Heatsink (Custom)
Thin Plate TTV (Thermal Test Vehicle)
TTV 2.0 Standardized Thermal Test Vehicle for AI Server, GPU & Cold Plate Validation
























