Thermal Test Vehicle (TTV)

High-Efficiency Thermal Management for AI, GPU & Data Centers- Cooling the Core of AI and HPC Innovation

Super High-Power TTV – Up to 500 W/cm² Simulate real AI chip and HPC thermal loads with ultra-high power density (500 W/cm²). Ideal for cold plates, heatsinks, and liquid/immersion cooling system testing.

Precision & Protection
Engineered for accurate thermal control and reliable test results. Built-in temperature feedback protects your setup by pausing tests when cooling is insufficient.

Accelerate your AI and HPC performance with advanced thermal solutions designed for today’s most demanding systems. From AI servers and GPU clusters to immersion cooling and cold plates, our high-power thermal modules deliver precise heat simulation, intelligent protection, and seamless integration with next-gen cooling systems.

👉 Explore smarter cooling, engineered for the future of computing info@ptc-heater.com.tw

Why Use TTV Modules?

High-precision heat simulation for single chips and large-scale systems.
Supports multi-zone and single-zone power configurations for realistic thermal scenarios.

TTV Thermal Test Vehicle-Single zone Power which accurates heat load emulation up to extreme power densities

Single-zone TTV

KLC TTV thermal Test Vehicle to accurate heat load emulation up to extreme power densities for your server/ rack

multi-zone TTV

Enhances cooling design validation, reducing hardware risk and development cycles.
Compatible with immersion cooling, liquid cooling, cold plates, and AI server systems.

TTV Module Types

High Power Density Simulation – Support up to 500 W/cm²

High Power Thermal Test Vehicle (TTV) for Chip Heat Simulation

Thin Plate TTV (Thermal Test Vehicle)

New TTV ( Thermal Test Vehicle) on Universal (TTV) for OAM cold plate

(Super High-Power TTV for OAM)

Multi-Zone Power TTV

High-power thermal simulation chip for GPU/DPU cooling systems

High-Power Thermal Test Emulator (TTE) – Thermal Test Vehicle (TTV)

Super High-Power TTV (Thermal Test Vehicle) with Heatsink

Thermal Test Vehicle simulating chip hotspots

Super High-Power TTV (Thermal Test Vehicle) with Bakelite

Available Power–Voltage Configurations

Thin Plate TTV (Thermal Test Vehicle)

For thermal testing with spatial constraints or power density requirements.

Dimensions: 30 × 30 mm – 80 × 80 mm
Voltage: 12V – 600V
Max Power (W):
Ex. 50 × 50 mm: Max. 1600W
80 × 80 mm: Max. 4200W

Super High-Power Thermal Test Vehicle (TTV)

Supports higher current and total power.

Dimensions: 30 × 30 mm – 80 × 80 mm
Voltage: 12V – 600V
Max Power (W):
Ex. 50 × 50 mm: Max. 5000W
80 × 80 mm: Max. 12800W

Thin Plate TTV (Thermal Test Vehicle) 110V / 220V

For quick testing scenarios without the need for complex power supplies.

Varies by size and power configuration:
Ex. 30 × 30 mm (110V): 80W or 260W
60 × 60 mm (220V): 1500W

Super High-Power TTV (Thermal Test Vehicle) 110V / 220V

For rapid testing setups — no external DC power supply required.

Varies by size and configuration:
Ex. 30 × 30 mm (110V): 80W, 260W, or 1500W
60 × 60 mm (220V): 1500W, 3000W, or 6000W

For more sizes and power configurations, please consult the complete specifications.

Get the specification sheet Now!

Applications of TTV Modules

What are TTVs used for?

Semiconductor Packaging & IC Design
Evaluate heat concentration, packaging materials’ thermal conductivity, and heat dissipation efficiency. Prevent chip overheating, validate high-density power designs, and ensure optimal IC performance.
CPU, GPU & AI Accelerator Testing (AMD, NVIDIA, AI Chips)
Simulate extreme thermal loads (up to 7,500 W per chip; roadmap up to 20,000 W) to prevent thermal throttling, optimize cooling, and ensure system reliability under peak power conditions.
Immersion Cooling & Liquid-Cooled Data Centers
Validate complete immersion cabinets, cold plates, pumps, and control modules, ensuring uniform heat extraction and system stability in high-density AI and HPC environments.
CDU (Cooling Distribution Unit) & Cold Plate Manufacturers
Test multiple water-cooled chips for flow control, temperature management, and rapid heat dissipation. Verify cooling efficiency under multi-chip high-power operation.
Server & Rack Integrators
Optimize rack-level cooling performance by simulating combined heat loads (up to 300,000 W per cabinet) using TTE (Thermal Test Emulator) combined with multi-zone TTV modules.
AI & HPC Thermal Performance Validation
Ensure AI servers, GPU clusters, and OAM modules maintain safe operating temperatures (<80°C) under extreme workloads, accelerating product development and deployment.
GPU Heatsink & Cold Plate Verification
Use single-zone and multi-zone TTVs to emulate hot spots across chips, supporting precise validation for heatsinks, vapor chambers, and liquid-cooled cold plates.

Scenario	Product Name	Description
	AI chip thermal simulation	High-performance AI computing chip thermal testing and heat dissipation verification
	High-Power Thermal Test Emulator (TTE)	Server rack thermal management and cooling system testing
	Super High-Power TTV	OAM cold plate cooling test
	Super High-Power TTV	Heat dissipation test of cooling components
	TTV for Heatsink	Heatsink heat dissipation test

Frequently Asked Questions

1. What is a TTV module?

A TTV (Thermal Test Vehicle) is a simulation device that mimics the thermal behavior of high-power electronics such as CPUs, GPUs, and AI chips. It allows engineers to test and optimize cooling systems under realistic heat loads without using actual components.

2. What power density can your TTV modules support?

Our Super High-Power TTV modules can simulate power densities up to 500 W/cm², ideal for testing thermal management systems in AI servers, HPC devices, and OAM modules.

3. What cooling systems are compatible with TTV modules?

TTV modules are compatible with a wide range of cooling solutions, including:

Liquid cooling systems (cold plates, water blocks)
Immersion cooling systems
Any types of Cooling setups

4. Can I monitor or control temperature during testing?

Yes. Our TTV modules feature integrated temperature sensors and support real-time feedback and control, allowing precise temperature management and automatic test interruption if overheating is detected.

5. Are these modules suitable for validating complete thermal solutions?

Absolutely. TTVs are ideal for simulating heat loads when designing or validating cold plates, heat sinks, and liquid cooling loops — helping shorten development cycles and ensure performance reliability.

6. Do you offer custom TTV designs?

Yes, we provide custom TTV modules tailored to specific form factors, power requirements, or interface types. Contact our engineering team for design consultation.

7. What industries benefit most from TTV solutions?

TTV (Thermal Test Vehicle) modules play a critical role in evaluating and optimizing thermal management solutions. Industries and components that particularly benefit from TTV solutions include:

Coolant
Cooling systems
Pumps
Controllers
CDUs (Coolant Distribution Units)
Tubing and piping systems
Liquid cold plates
Heat sinks
Heat pipes
Racks and enclosures
PCBs (Printed Circuit Boards)
IC design
IC packaging (e.g., OSAT providers)
OAM (OCP Accelerator Modules)
Semiconductor industry

8. What is the difference between a TTV (Thermal Test Vehicle) and a TTE (Thermal Test Emulator)?

TTV (Thermal Test Vehicle): A single-chip thermal test module designed to simulate the heat output of CPUs, GPUs, and AI accelerators, including localized hot spots.
TTE (Thermal Test Emulator): A rack-level thermal test system that integrates multiple TTVs to emulate the total heat load of an entire server board or rack, enabling system-level thermal performance validation.