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Thermal Test Vehicle (TTV) Product

Thermal Test Vehicles (TTV) & Thermal Test Emulators (TTE) — Advanced Cooling Validation for AI & HPC

As AI processors continue pushing power density boundaries, thermal validation has become a critical part of cooling system development. KLC offers a complete line of Thermal Test Vehicles (TTVs) and Thermal Test Emulators (TTEs) designed for chip-level, board-level, and system-level thermal validation.

Driven by next-generation AI servers, HPC platforms, GPU accelerators, and automotive ADAS processors, engineers must validate cold plates, liquid cooling systems, CDUs, and advanced thermal architectures before production silicon becomes available.

👉 Explore smarter cooling, engineered for the future of computing — info@ptc-heater.com.tw


How to Select the Right Thermal Test Vehicle

Different thermal validation requirements correspond to different TTV solutions. Use the guide below to find the right product.

Application Recommended Product Typical Validation Scenario
AI Server Cold Plate Validation Super High-Power TTV Cold Plate Thermal Resistance Testing
AI GPU Thermal Simulation Thin Plate TTV GPU Package Thermal Simulation
GPU Hotspot Analysis Multi-Zone TTV Localized Hotspot Validation
AI Accelerator Cooling Validation Super High-Power TTV for AI Accelerator AI Accelerator Thermal Performance Testing
CDU Validation Super High-Power TTV Cooling Distribution Evaluation
Rack-Level Cooling Test TTE Rack-Level Thermal Validation
Two-Phase Cooling Validation Multi-Zone TTV Phase-Change Cooling Analysis

Explore KLC Thermal Test Vehicle (TTV) Solutions

TTV Module Types (High Power Density Simulation — up to 500 W/cm² and above)

Choose the right thermal test solution based on your application requirements.

KLC TTV 2.0 Thin Plate Thermal Test Vehicle

Thin Plate TTV (Thermal Test Vehicle)

Standard thin-plate thermal test vehicle, suitable for space-constrained or standard power density thermal testing.

  • Dimensions: 30 × 30 mm – 80 × 80 mm
  • Voltage: 12V – 600V
  • See full specifications for more sizes and configurations.

KLC TTV 2.0 Standardized High-Power Thermal Test Vehicle for AI Server, CPU, GPU and Cold Plate Thermal Validation

Super High-Power TTV for OAM

Ultra-thin TTV with high thermal conductivity copper block design. Supports higher maximum current and total power.

  • Dimensions: 30 × 30 mm – 80 × 80 mm
  • Voltage: 12V – 600V

See full specifications for more sizes and configurations.

Thermal Test Vehicle simulating chip hotspots

Super High-Power TTV with Bakelite Base

Designed for safe mounting onto water-cooled cold plates.

Super High-Power TTV with Heatsink

Super High-Power TTV with Heatsink (Custom)

Compatible with custom heatsinks / cold plates and cooling solutions for real-world thermal flow testing.

Multi-Zone Power Thermal Test Vehicle

Multi-Zone Power TTV (Thermal Test Vehicle)

Multiple independently controlled heating zones to simulate localized chip hotspot distribution.

High-power thermal simulation chip for GPU/DPU cooling systems

Server Rack Thermal Test Emulator (TTE)

Rack-level thermal test platform composed of multiple TTVs. Supports up to 300,000W for server cabinet cooling validation and immersion cooling testing.


Why Choose KLC Thermal Test Vehicles?

  • Precisely simulates real chip and rack heat load behavior
  • Reduces thermal design risk and accelerates product development cycles
  • Customizable voltage / current / dimensions for flexible applications
  • Single-zone TTV: uniform heating simulation
  • Multi-zone TTV: localized hotspot simulation with independent zone control
  • Ultra-thin TTV: supports high power density testing

Typical Application Scenarios

  • AI Server Cold Plate Validation: Validate cold plate heat dissipation under various flow rates, temperatures, and thermal loads. Optimize microchannel design and improve overall thermal efficiency.
  • AI GPU and AI Accelerator Thermal Simulation: Simulate actual thermal loads of AI GPUs, HPC chips, and accelerators. Validate thermal management performance of heatsinks, cold plates, and liquid cooling systems.
  • Multi-Zone Hotspot Analysis: Use Multi-Zone TTV to simulate heat generation patterns across different chip regions, helping analyze localized overheating and optimize thermal design.
  • CDU Cooling Capacity Validation: Evaluate cooling efficiency and system stability of Cooling Distribution Units under varying flow rates and thermal loads.
  • Two-Phase Cooling Testing: Simulate high heat flux conditions to validate phase-change cooling system performance and reliability.
  • Rack-Level Thermal Management Validation: Use Thermal Test Emulator (TTE) to build a system-level thermal environment and validate overall rack and data center cooling architecture.
  • Semiconductor packaging and IC design validation

​

Application Scenario Product Description
How TTV 2.0 Thermal Test Vehicle works on cooling system test Multi-Zone Power TTV (Thermal Test Vehicle) on KLC TTV 2.0 Micro-channel cold plate & direct-to-chip cooling testing / thermal validation for HPC chips
TTV for AI Chip Thermal Testing High-Power Thermal Test Chip High-performance computing chip thermal testing & cooling validation
Server Rack Thermal Test Emulator Server Rack Thermal Test Emulator (TTE) Server rack thermal management and cooling system testing
TTV for Cold Plate Thermal Validation Super High-Power TTV (OAM) OAM cold plate thermal resistance testing
TTV Application Scenarios Super High-Power TTV Thermal component cooling performance testing
TTV for Heatsink Testing Super High-Power TTV Heatsink fin thermal performance testing

Compare KLC TTV Solutions

Product Best For Key Feature
Thin Plate TTV GPU Thermal Simulation Ultra-Thin Structure
Multi-Zone TTV Hotspot Analysis Independent Heating Zones
Super High-Power TTV Cold Plate Validation Up to 500 W/cm²
Super High-Power TTV for OAM OAM Cooling Validation OAM Form Factor
TTE Rack-Level Testing System-Level Validation

Available Power–Voltage Configurations

Thin Plate TTV (Thermal Test Vehicle)

For thermal testing with spatial constraints or standard power density requirements.

  • Dimensions: 30 × 30 mm – 80 × 80 mm
  • Voltage: 12V – 600V
  • Max Power: Ex. 50 × 50 mm: Max. 1,600W | 80 × 80 mm: Max. 4,200W

Super High-Power Thermal Test Vehicle (TTV)

Supports higher current and total power.

  • Dimensions: 30 × 30 mm – 80 × 80 mm
  • Voltage: 12V – 600V
  • Max Power: Ex. 50 × 50 mm: Max. 5,000W | 80 × 80 mm: Max. 12,800W

For more sizes and power configurations, please consult the complete specifications.

Get the specification sheet Now!


Frequently Asked Questions (FAQs)

Q1. Which TTV is suitable for AI server cold plate validation?

Super High-Power TTV is recommended for high heat flux and cold plate thermal performance testing.

Q2. Which TTV is suitable for GPU hotspot simulation?

Multi-Zone TTV can reproduce localized hotspot conditions through independently controlled heating zones.

Q3. Can KLC provide custom TTV designs?

Yes. KLC supports customized dimensions, power levels, heating patterns, sensor integration, and mounting configurations.

Need Help Selecting the Right Thermal Test Vehicle?

Whether you are validating an AI server cold plate, liquid cooling architecture, CDU, or two-phase cooling system, KLC’s engineering team can recommend the most suitable TTV solution for your project.

Request Technical Consultation or Request Datasheet, contact: info@ptc-heater.com.tw