Super High-Power Thermal Test Vehicle (TTV)- Heat Simulation Module for OAM

KLC’s Heat Simulation Module:

  • High-power AI server and GPU/DPU heat dissipation testing
  • Ultra-high power density up to 500 W/cm²
  • Liquid cooling system, immersion cooling system, Cold Plate, Heatsinks and Cooling Distribution Units(CDU) testing
  • Replacing  high-priced AI chip for performance testing and its thermal management.
  • Dimensions: 30 × 30 mm – 80 × 80 mm (or Customization)
  • Voltage: 12V – 600V
  • Max Power: up to 12,800W
Dimensions (mm) Adjustable Voltage (V) Max Current (A) Max.Power (W)
30 × 30 12–600 15.0 1800
35 × 35 12–600 21.0 2450
40 × 40 12–600 14.0 3200
50 × 50 12–600 10.4 5000
60 × 60 12–600 12.5 7200
80 × 80 12–600 50.6 12800

 

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Product Description

Next-Gen Thermal  Solution for AI Servers, GPUs & DPUs

Flexible, scalable thermal load solution for high-power electronics cooling validation.

– Reviewed by KLC Thermal Solutions Engineering Team, updated in Dec 2025·

Next-Gen Thermal Solution for AI Servers, GPUs & DPUs: The  Super High-Power TTV for OAM by KLC Corporation,  is engineered to meet the AI processor heat testing demands of next-generation AI Servers, GPUs, and DPUs. Designed specifically for Open Accelerator Modules (OAM) used in GPUs, AI chips, DPUs, and CPUs, this cutting-edge tool simulates thermal loads with a super high- power density of up to 500 W/cm².

It’s the ideal thermal solution for testing liquid cooling systems, immersion cooling systems for AI chips, cold plates, heatsinks, and Cooling Distribution Units (CDUs), ensuring optimal performance in High-Performance Computing (HPC), Machine Learning (ML), and cloud data centers. The Super High-Power Thermal Test Vehicle (TTV) addresses these challenges by offering precise heat simulation, compatibility with diverse PCB layouts, and seamless integration into existing test platforms—making it a must-have for labs and enterprises developing innovative AI Server cooling solutions.

KLC’s Super High- Power Thermal Test Vehicle series – TTV Power-Adjustable Thermal Test Vehicle is designed for engineers who require precise, adjustable thermal loading during thermal simulations, cooling system validation, and performance benchmarking. The TTV allows users to freely select the required power level by tuning the input voltage, making it suitable for diverse test scenarios and rapid system evaluations as a cost-saving high-power thermal test chip. The TTV can be paired with an adjustable DC power supply; simply start at a low voltage (low power output) and gradually increase the voltage until the desired power level is reached to simulate the target heat load. An optional integrated temperature sensor is available for real-time temperature monitoring during system testing.

If you need 3D simulation or STEP file requirements, feel free to contact us:info@ptc-heater.com.tw

Key Features

  • Adjustable Power Output: Select heat load by tuning the input voltage based on the test requirement in your cooling systems.
  • Wide Power Range: Enables High-power AI chip testing from low-power scenarios up to custom Super High-Power loads (e.g., 7,500W), vital for AI chip thermal test platforms.
  • Simple & Safe Operation: Start with low voltage and gradually increase power to reach the target wattage.
  • Optional Integrated Temperature Sensor: Real-time thermal feedback for thermal analysis and safety monitoring.
  • Flexible Size Options (30 × 30 mm to 80 × 80 mm): Supports multiple footprints to match different thermal validation needs; Standard sizes range from 30 × 30 mm up to 80 × 80 mm, and custom dimensions can be designed upon request to simulate specific chip sizes or heat sources.
  • Super High- Power Density Simulation: Capable of simulating heat flux up to 500 W/cm², precisely corresponding to the thermal load of AI chips and HPC devices.
  • Extreme Total Power Output: Capable of simulating Super High-Power loads up to 12,800W. This is crucial for validating cooling performance in high-power electronics or AI Server cooling system and heat dissipation solution.  

 

Customizable Options Available

We support full customization for Thermal management for AI processors and specialized testing needs.

  • Custom sizes
  • Specific power rating (W)
  • Required power density
  • Fixed (110V /220V) or adjustable voltage design  
  • Sensor options   
  • Application-specific thermal design
  • Mechanical form factor, mounting, and interface customization

 

How to Select Your TTV

  1. Begin by identifying the target power range (W) and operating voltage (V) needed for your test scenario.
  2. Specify the required cooling interface (air, liquid, immersion, or OAM architecture).
  3. If temperature monitoring is required, please indicate this so we can include the appropriate sensor options.
  4. Our engineering team will recommend the best-fit configuration and provide a detailed specification sheet.

Available Power–Voltage Configurations

12V~600V Super High-Power Thermal Test Vehicle (TTV)

Dimensions (mm)Adjustable Voltage (V)Power Range (W)Maximum Current (A)
30 x 3012 ~ 485 ~ 2806
30 x 3024 ~ 8015 ~ 80010
30 x 3048 ~ 12020 ~ 180015
30 x 3080 ~ 20050 ~ 180015
30 x 30120 ~ 250100 ~ 180015
30 x 30200 ~ 400300 ~ 18006.3
30 x 30250 ~ 600450 ~ 18003.5
35 x 3512 ~ 4810 ~ 4008.6
35 x 3524 ~ 8030 ~ 115014.4
35 x 3548 ~ 12030 ~ 245021
35 x 3580 ~ 20080 ~ 24509.1
35 x 35120 ~ 250200 ~ 245010.6
35 x 35200 ~ 400500 ~ 245010.6
35 x 35250 ~ 600750 ~ 24505.3
40 x 4012 ~ 485 ~ 3808
40 x 4024 ~ 8020 ~ 100014
40 x 4048 ~ 12080 ~ 240020
40 x 4080 ~ 20080 ~ 32006.7
40 x 40120 ~ 250200 ~ 32008.3
40 x 40200 ~ 400500 ~ 32005
40 x 40250 ~ 600800 ~ 32006.3
50 x 5012 ~ 4810 ~ 3808
50 x 5024 ~ 8025 ~ 105013.3
50 x 5048 ~ 12060 ~ 240020
50 x 5080 ~ 200150 ~ 50008.3
50 x 50120 ~ 250300 ~ 500010.4
50 x 50200 ~ 400850 ~ 50008.3
50 x 50250 ~ 6001400 ~ 500010.2
60 x 6012 ~ 4810 ~ 2806
60 x 6024 ~ 8020 ~ 80010
60 x 6048 ~ 12080 ~ 180015
60 x 6080 ~ 200200 ~ 500012.5
60 x 60120 ~ 250450 ~ 72007.8
60 x 60200 ~ 4001300 ~ 720012.5
60 x 60250 ~ 6002000 ~ 720015
80 x 8012 ~ 4810 ~ 4509.6
80 x 8024 ~ 8020 ~ 120016
80 x 8048 ~ 12080 ~ 280024
80 x 8080 ~ 200200 ~ 220040
80 x 80120 ~ 250400 ~ 345050
80 x 80200 ~ 4001200 ~ 1280050.6
80 x 80250 ~ 6001800 ~ 1280026.7

110V / 220V Super High-Power Thermal Test Vehicle (TTV)

Voltage (V)Dimensions (mm)Selectable Power (W)
11030 x 3080, 260, 1500
11035 x 35130, 550, 2100
11040 x 40150, 400, 2000
11050 x 50250, 500, 2000
11060 x 60360, 740, 1500
11080 x 80320, 660, 2400
22030 x 30320, 1000
22035 x 35540, 2200
22040 x 40600, 1600
22050 x 501000, 2000
22060 x 601500, 3000, 6000
22080 x 801300, 2600, 9600

Technical Specifications

  • Cooling Systems Supported: Liquid cooling and immersion cooling systems.
  • Maximum Power Density  up to  500 W/cm², available upon request.
  • For More Specs: Contact us at info@ptc-heater.com.tw.

AI Accelerator Thermal Test Vehicle (TTV)

Size A (mm) Size B (mm) Adjustable Voltage (V) Max.Power (W)
30 × 30 20–30 12–600 1800
35 × 35 30–35 12–600 2450
40 × 40 30–40 12–600 3200
50 × 50 40–50 12–600 5000
60 × 60 50–60 12–600 7200
80 × 80 60–80 12–600 12800

 

 

Customize Your TTV

In addition to our standard product range, KLC offers full customization to meet application-specific requirements.

We can tailor your TTV based on:

  • Custom dimensions (30 × 30 mm up to 80 × 80 mm, or other sizes upon request)
  • Target power rating
  • Required power density
  • Fixed or adjustable voltage
  • Integrated temperature sensor options
  • Mounting, interface, and layout customization
  • Application-specific thermal design

Simply share your required heat load, voltage, and mechanical constraints, and our engineering team will design the optimal TTV for your system.

 

Application Scenarios

  • OAM Modules for AI GPUs
    Ensure high-load stability with precise thermal emulation.

  • AI Servers & DPU Platforms
    Test reliability and performance of cooling systems under realistic conditions.

  • TTV on UBB (Universal Baseboard)
    Evaluate different board layouts and cooling designs.

  • Cold Plate Development
    Optimize cold plate and heatsink designs for OAM modules.

TTV under cold plate of OAM
TTV on UBB

Heatsink on TTV

TTV for Heatsink Testing

TTV on cold plate of OAM

TTV on cold plate of OAM

TTV (on OAM cold plate of GPU)

Cold Plate development

 

R&D Insight about Super High-Power Thermal Test Vehicle (TTV)

An IEEE ECTC 2024 study detailed a dual-phase cooling TTV achieving over 1000 W heat dissipation and hotspot densities up to 400 W/cm²—demonstrating scalable validation for AI datacenter thermal management.

 

Why Choose KLC’s Super High-Power TTV?

  • Its Super high power density, precision temperature control, and versatile applications, the Super High-Power TTV for OAM is a game-changer in cooling system testing.
  • Versatile Applications
    Perfect for testing cold plates, heatsinks, liquid cooling, immersion cooling, and full cooling distribution units (CDUs).
  • Cost Reduction
    Eliminates the need to use expensive AI processors during the R&D and validation stages.
  • Faster Development Cycles
    Allows earlier testing and optimization of thermal systems — no need to wait for chip available.
  • Accelerates Innovation
    Empowers thermal engineers and system designers to prototype, validate, and launch solutions more efficiently.
  • Competitive Edge
    Helps businesses deliver optimized, high-performance cooling systems faster — gaining an edge in the AI and data center market.

Trusted Use Case

In OCP UBB chassis experiments, Thermal Test Vehicles up to 1000 W each were used to validate coolant flow distribution and manifold design—enhancing system reliability in high-power OAM deployments. Source: OCP Liquid Cooling Guidelines

 

Frequently Asked Questions (FAQs) – Super High- Power Thermal Test Vehicle (TTV)

Q1. What is a Super High- Power Thermal Test Vehicle (TTV)?

Super High- Power Thermal Test Vehicle (TTV) is a Next-Gen thermal test module designed to replicate the heat generation of advanced processors, GPUs, and AI accelerators. It allows engineers to validate cooling solutions such as cold plates, immersion tanks, and heat sinks without requiring functional real AI Chips/ Servers, reducing cost and risk during system design.

Q2. What power levels can a Super High-Power TTVs simulate?

Our Super High- Power TTVs can simulate a wide power range, from hundreds of watts up to 12,800 W. Future designs are projected to reach to 20,000W to match future HPC and AI processor trends.

Q3. Which cooling systems are compatible with Super High- Power Thermal Test Vehicle (TTV)?

High Power TTVs are widely used across:

  • Immersion cooling systems – to evaluate cabinet-level thermal removal efficiency and optimize cold plate/fin design inside cooling fluids.
  • Liquid cooling (CDU + cold plates) – to validate coolant flow distribution, detect control accuracy, and confirm high-power chip heat removal.
  • Airflow-based cooling – to test high-performance heat sinks and hybrid solutions.
  • This flexibility makes TTVs ideal for data centers, server OEMs, and cooling technology providers.

Q4. What industries typically use High Power TTVs?

Industries requiring the Super High-Power TTVs include:

  • Immersion cabinet manufacturers (e.g., Google partners, Wiwynn) → need to verify full-cabinet cooling efficiency.
  • Liquid cooling/CDU suppliers → test water distribution, flow control, and cold plate efficiency.
  • Semiconductor packaging & IC design companies (e.g., TSMC, NVIDIA) → evaluate thermal conductivity, thin-die heat transfer, and hotspot management.
  • CPU/GPU manufacturers (e.g., AMD, NVIDIA) → simulate real chip heat loads up to 7.5 kW per device.
  • Server & rack integrators → optimize rack-level cooling for multi-chip systems.

Q5. What are the key advantages of using a High Power TTV?

  • Accurate heat simulation (uniform and non-uniform hotspots)
  • Supports future-proof power densities (up to 20,000 W per chip)
  • Thin-profile design (as low as 0.6 mm with AlN substrates) for advanced packaging
  • Reduces thermal risk by validating cooling before CPU/GPU tape-out
  • Accelerates time-to-market for AI servers, HPC systems, and next-gen data centers

Q6. Can the High Power TTV be customized?

Yes, the Super High-Power TTV can be fully customized for maximum test fidelity.
KLC offers full customization including dimensions, target power, power density, voltage type, sensor options, mounting interfaces, and application-specific thermal design.

 

Get Started Today!

Elevate your thermal management and lead the way in AI, GPU and DPU innovation!

Contact our engineering team today to receive a detailed specification sheet and a custom quote: info@ptc-heater.com.tw

 

 

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