Super High-Power Thermal Test Vehicle (TTV)- Heat Simulation Module for OAM

Next-Gen Thermal  Solution for AI Servers, GPUs & DPUs

Flexible, scalable thermal load solution for high-power electronics cooling validation.

– Reviewed by KLC Thermal Solutions Engineering Team, updated in Dec 2025·

Next-Gen Thermal Solution for AI Servers, GPUs & DPUs: The  Super High-Power TTV for OAM by KLC Corporation,  is engineered to meet the AI processor heat testing demands of next-generation AI Servers, GPUs, and DPUs. Designed specifically for Open Accelerator Modules (OAM) used in GPUs, AI chips, DPUs, and CPUs, this cutting-edge tool simulates thermal loads with a super high- power density of up to 500 W/cm².

It’s the ideal thermal solution for testing liquid cooling systems, immersion cooling systems for AI chips, cold plates, heatsinks, and Cooling Distribution Units (CDUs), ensuring optimal performance in High-Performance Computing (HPC), Machine Learning (ML), and cloud data centers. The Super High-Power Thermal Test Vehicle (TTV) addresses these challenges by offering precise heat simulation, compatibility with diverse PCB layouts, and seamless integration into existing test platforms—making it a must-have for labs and enterprises developing innovative AI Server cooling solutions.

KLC’s Super High- Power Thermal Test Vehicle series – TTV Power-Adjustable Thermal Test Vehicle is designed for engineers who require precise, adjustable thermal loading during thermal simulations, cooling system validation, and performance benchmarking. The TTV allows users to freely select the required power level by tuning the input voltage, making it suitable for diverse test scenarios and rapid system evaluations as a cost-saving high-power thermal test chip. The TTV can be paired with an adjustable DC power supply; simply start at a low voltage (low power output) and gradually increase the voltage until the desired power level is reached to simulate the target heat load. An optional integrated temperature sensor is available for real-time temperature monitoring during system testing.

If you need 3D simulation or STEP file requirements, feel free to contact us:info@ptc-heater.com.tw

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Key Features

• Adjustable Power Output: Select heat load by tuning the input voltage based on the test requirement in your cooling systems.
• Wide Power Range: Enables High-power AI chip testing from low-power scenarios up to custom Super High-Power loads (e.g., 7,500W), vital for AI chip thermal test platforms.
• Simple & Safe Operation: Start with low voltage and gradually increase power to reach the target wattage.
• Optional Integrated Temperature Sensor: Real-time thermal feedback for thermal analysis and safety monitoring.
• Flexible Size Options (30 × 30 mm to 80 × 80 mm): Supports multiple footprints to match different thermal validation needs; Standard sizes range from 30 × 30 mm up to 80 × 80 mm, and custom dimensions can be designed upon request to simulate specific chip sizes or heat sources.
• Super High- Power Density Simulation: Capable of simulating heat flux up to 500 W/cm², precisely corresponding to the thermal load of AI chips and HPC devices.
• Extreme Total Power Output: Capable of simulating Super High-Power loads up to 12,800W. This is crucial for validating cooling performance in high-power electronics or AI Server cooling system and heat dissipation solution.  

 

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Customizable Options Available

We support full customization for Thermal management for AI processors and specialized testing needs.

• Custom sizes
• Specific power rating (W)
• Required power density
• Fixed (110V /220V) or adjustable voltage design  
• Sensor options   
• Application-specific thermal design
• Mechanical form factor, mounting, and interface customization

 

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How to Select Your TTV

1. Begin by identifying the target power range (W) and operating voltage (V) needed for your test scenario.
2. Specify the required cooling interface (air, liquid, immersion, or OAM architecture).
3. If temperature monitoring is required, please indicate this so we can include the appropriate sensor options.
4. Our engineering team will recommend the best-fit configuration and provide a detailed specification sheet.

Available Power–Voltage Configurations

12V~600V Super High-Power Thermal Test Vehicle (TTV)

Dimensions (mm)	Adjustable Voltage (V)	Power Range (W)	Maximum Current (A)
30 x 30	12 ~ 48	5 ~ 280	6
30 x 30	24 ~ 80	15 ~ 800	10
30 x 30	48 ~ 120	20 ~ 1600	15
30 x 30	80 ~ 200	50 ~ 2000	16
30 x 30	120 ~ 250	100 ~ 2000	16
30 x 30	200 ~ 400	300 ~ 2000	7
30 x 30	250 ~ 600	450 ~ 2000	7
35 x 35	12 ~ 48	5 ~ 400	10
35 x 35	24 ~ 80	15 ~ 1000	14
35 x 35	48 ~ 120	30 ~ 2000	20
35 x 35	80 ~ 200	100 ~ 2200	20
35 x 35	120 ~ 250	200 ~ 2500	12
35 x 35	200 ~ 400	500 ~ 2500	8
35 x 35	250 ~ 600	750 ~ 2500	6
40 x 40	12 ~ 48	5 ~ 380	8
40 x 40	24 ~ 80	20 ~ 1000	13
40 x 40	48 ~ 120	60 ~ 2000	19
40 x 40	80 ~ 200	80 ~ 2400	20
40 x 40	120 ~ 250	200 ~ 3000	16
40 x 40	200 ~ 400	500 ~ 3200	11
40 x 40	250 ~ 600	800 ~ 3200	11
50 x 50	12 ~ 48	10 ~ 380	8.0
50 x 50	24 ~ 80	25 ~ 1000	13.3
50 x 50	48 ~ 120	60 ~ 1600	17
50 x 50	80 ~ 200	150 ~ 2500	15
50 x 50	120 ~ 250	300 ~ 4000	19
50 x 50	200 ~ 400	850 ~ 4500	10
50 x 50	250 ~ 600	1400 ~ 5000	11
60 x 60	12 ~ 48	10 ~ 280	6
60 x 60	24 ~ 80	20 ~ 800	10
60 x 60	48 ~ 120	80 ~ 1800	15
60 x 60	80 ~ 200	200 ~ 2400	13
60 x 60	120 ~ 250	450 ~ 3600	15
60 x 60	200 ~ 400	1300 ~ 4600	12
60 x 60	250 ~ 600	2000 ~ 5000	12.5
80 x 80	12 ~ 48	10 ~ 450	10
80 x 80	24 ~ 80	20 ~ 1200	16
80 x 80	48 ~ 120	80 ~ 2000	20
80 x 80	80 ~ 200	200 ~ 3000	19
80 x 80	120 ~ 250	400 ~ 4000	21
80 x 80	200 ~ 400	1200 ~ 6000	19
80 x 80	250 ~ 600	1800 ~ 8000	15

110V / 220V Super High-Power Thermal Test Vehicle (TTV)

Voltage (V)	Dimensions (mm)	Selectable Power (W)
110	30 x 30	80, 260, 1500
110	35 x 35	130, 550, 2100
110	40 x 40	150, 400, 2000
110	50 x 50	250, 500, 2000
110	60 x 60	360, 740, 1500
110	80 x 80	320, 660, 2400
220	30 x 30	320, 1000
220	35 x 35	540, 2200
220	40 x 40	600, 1600
220	50 x 50	1000, 2000
220	60 x 60	1500, 3000, 6000
220	80 x 80	1300, 2600, 9600

Technical Specifications

• Cooling Systems Supported: Liquid cooling and immersion cooling systems.
• Maximum Power Density  up to  500 W/cm², available upon request.
• For More Specs: Contact us at info@ptc-heater.com.tw.

A’ (mm)	B’ (mm)	Adjustable Voltage (V)	Max.Power (W)
20–30	20–30	12–600	2000
30–35	30–35	12–600	2500
30–40	30–40	12–600	3200
40–50	40–50	12–600	5000
50–60	50–60	12–600	5000
60–80	60–80	12–600	8000

 

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Customize Your TTV

In addition to our standard product range, KLC offers full customization to meet application-specific requirements.

We can tailor your TTV based on:

-Custom dimensions (30 × 30 mm up to 80 × 80 mm, or other sizes upon request)

-Target power rating

-Required power density

-Fixed or adjustable voltage

-Integrated temperature sensor options

-ounting, interface, and layout customization

-Application-specific thermal design

Simply share your required heat load, voltage, and mechanical constraints, and our engineering team will design the optimal TTV for your system.

 

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Application Scenarios

-OAM Modules for AI GPUs
Ensure high-load stability with precise thermal emulation.

-AI Servers & DPU Platforms
Test reliability and performance of cooling systems under realistic conditions.

-TTV on UBB (Universal Baseboard)
Evaluate different board layouts and cooling designs.

-Cold Plate Development
Optimize cold plate and heatsink designs for OAM modules.

TTV for Heatsink Testing

TTV on cold plate of OAM

Cold Plate development

 

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R&D Insight about Super High-Power Thermal Test Vehicle (TTV)

An IEEE ECTC 2024 study detailed a dual-phase cooling TTV achieving over 1000 W heat dissipation and hotspot densities up to 400 W/cm²—demonstrating scalable validation for AI datacenter thermal management.

 

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Why Choose KLC’s Super High-Power TTV?

Its Super high power density, precision temperature control, and versatile applications, the Super High-Power TTV for OAM is a game-changer in cooling system testing.

-Versatile Applications:
Perfect for testing cold plates, heatsinks, liquid cooling, immersion cooling, and full cooling distribution units (CDUs).

-Cost Reduction:
Eliminates the need to use expensive AI processors during the R&D and validation stages.

-Faster Development Cycles:
Allows earlier testing and optimization of thermal systems — no need to wait for chip available.

-Accelerates Innovation:
Empowers thermal engineers and system designers to prototype, validate, and launch solutions more efficiently.

-Competitive Edge:
Helps businesses deliver optimized, high-performance cooling systems faster — gaining an edge in the AI and data center market.

Trusted Use Case

In OCP UBB chassis experiments, Thermal Test Vehicles up to 1000 W each were used to validate coolant flow distribution and manifold design—enhancing system reliability in high-power OAM deployments. Source: OCP Liquid Cooling Guidelines

 

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Frequently Asked Questions (FAQs) – Super High- Power Thermal Test Vehicle (TTV)

Q1. What is a Super High- Power Thermal Test Vehicle (TTV)?

Super High- Power Thermal Test Vehicle (TTV) is a Next-Gen thermal test module designed to replicate the heat generation of advanced processors, GPUs, and AI accelerators. It allows engineers to validate cooling solutions such as cold plates, immersion tanks, and heat sinks without requiring functional real AI Chips/ Servers, reducing cost and risk during system design.

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Q2. What power levels can a Super High-Power TTVs simulate?

Our Super High- Power TTVs can simulate a wide power range, from hundreds of watts up to 12,800 W. Future designs are projected to reach to 20,000W to match future HPC and AI processor trends.

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Q3. Which cooling systems are compatible with Super High- Power Thermal Test Vehicle (TTV)?

High Power TTVs are widely used across:

-Immersion cooling systems – to evaluate cabinet-level thermal removal efficiency and optimize cold plate/fin design inside cooling fluids.
-Liquid cooling (CDU + cold plates) – to validate coolant flow distribution, detect control accuracy, and confirm high-power chip heat removal.
-Airflow-based cooling – to test high-performance heat sinks and hybrid solutions.
-This flexibility makes TTVs ideal for data centers, server OEMs, and cooling technology providers.

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Q4. What industries typically use High Power TTVs?

Industries requiring the Super High-Power TTVs include:

-Immersion cabinet manufacturers (e.g., Google partners, Wiwynn) → need to verify full-cabinet cooling efficiency.

-Liquid cooling/CDU suppliers → test water distribution, flow control, and cold plate efficiency.

-Semiconductor packaging & IC design companies (e.g., TSMC, NVIDIA) → evaluate thermal conductivity, thin-die heat transfer, and hotspot management.

-CPU/GPU manufacturers (e.g., AMD, NVIDIA) → simulate real chip heat loads up to 7.5 kW per device.

-Server & rack integrators → optimize rack-level cooling for multi-chip systems.

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Q5. What are the key advantages of using a High Power TTV?

-Accurate heat simulation (uniform and non-uniform hotspots)

-Supports future-proof power densities (up to 20,000 W per chip)

-Thin-profile design (as low as 0.6 mm with AlN substrates) for advanced packaging

-Reduces thermal risk by validating cooling before CPU/GPU tape-out

-Accelerates time-to-market for AI servers, HPC systems, and next-gen data centers

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Q6. Can the High Power TTV be customized?

Yes, the Super High-Power TTV can be fully customized for maximum test fidelity.
KLC offers full customization including dimensions, target power, power density, voltage type, sensor options, mounting interfaces, and application-specific thermal design.

 

Installation & Safety

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Q7: Is Thermal Interface Material (TIM/Thermal Grease) required during TTV installation?

If the contact surfaces are sufficiently flat and uniform pressure is applied, conducting a “dry test” without thermal grease can sometimes yield more precise thermal resistance data by eliminating material variables. However, to simulate real-world chip workloads (as actual chips typically utilize TIM), grease should be applied according to the specific application scenario.

Q8: How should the TTV be secured to ensure optimal heat conduction?

The TTV must be tightly pressed and fixed onto the cooling device using either external fixtures or custom-designed screw holes. Maintaining tight adhesion is critical; a minimum pressure of 65 psi is recommended, and the TTV body is designed to withstand a total pressure of at least 300KG. “Dry burning” (powering the device without an active cooling system) is strictly prohibited, as the lack of heat dissipation will cause the TTV to burn out instantly.

Q9: Does the TTV feature an automatic temperature control function?

No. The TTV operates on the principle of resistive heating rather than being a PTC (Positive Temperature Coefficient) component; therefore, it does not possess self-regulating temperature characteristics. Customers must independently install temperature controllers and over-current protection (such as circuit breakers) to prevent permanent damage caused by overheating.

 

Get Started Today!

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Elevate your thermal management and lead the way in AI, GPU and DPU innovation!

Contact our engineering team today to receive a detailed specification sheet and a custom quote: info@ptc-heater.com.tw

 

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