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High-Power Thermal Test Vehicle (TTV)- Thermal Simulation Module for AI Chips
- Simulates AI Chips, HPC and High-Power CPUs
- Ideal for Immersion Cooling System Testing
- Cost-Effective Solution
- High-Precision Temperature Control
- Maximum Power Density up to 500 W/cm², available upon request!
| Size A (mm) | Size B (mm) | Voltage(V) | Max. Power (W) | ||
| 50×50 | 50×50 | <200 | 2500 | ||
| 50×50 | 40×40 | <200 | 1600 | ||
| 50×50 | 30×30 | <200 | 900 | ||
| 50×50 | 20×20 | <200 | 400 |
Product Description
The High-Power Thermal Test Vehicle (TTV) is an essential tool for thermal engineers, designed to precisely simulate the extreme heat loads of modern AI chips, GPUs, and HPC processors. Capable of generating power densities up to 500 W/cm² and total power up to 2500W, the TTV is a cost-effective and safe alternative to testing with actual, expensive silicon. It enables the accurate validation and optimization of next-generation cooling systems, including liquid cold plates and immersion cooling, ensuring reliable performance and faster time-to-market for AI server solutions.
Expertise & Trust — Proven by 40+ Years of Engineering Experience
For over four decades, KLC Corporation has led the field of PTC heating and thermal control.
The High-Power TTV combines KLC’s advanced material science and engineering design to meet the extreme thermal challenges of AI hardware and GPU clusters.
If you need 3D simulation or STEP file requirements, feel free to contact us:info@ptc-heater.com.tw
Key Features of Thermal Test Vehicle (TTV):
- Simulates AI Chips, HPCand High-Power CPUs: Capable of reaching up to 2500W power output, this chip is designed to simulate the thermal behavior of the latest AI chips, HPC and high-power CPUs.
- Ideal for Immersion Cooling System Testing: Specifically engineered for immersion cooling system testing, providing accurate thermal profiles to evaluate cooling efficiency.
- Cost-Effective Solution: By using this Thermal Test Vehicle (TTV) chip, labs can save costs by avoiding the use of expensive real AI chips and CPUs for testing purposes.
- High-Precision Temperature Control: Ensures precise thermal simulation suitable for advanced semiconductor packaging and cooling system testing environments.
- Plug-and-Play Design: Compatible with various PCB layouts, this test chip can be easily integrated into existing test platforms, reducing development cycles.
Specifications
| Size A (mm) | Size B (mm) | Voltage(V) | Max. Power (W) | ||
| 50×50 | 50×50 | <200 | 2500 | ||
| 50×50 | 40×40 | <200 | 1600 | ||
| 50×50 | 30×30 | <200 | 900 | ||
| 50×50 | 20×20 | <200 | 400 |
Maximum Power Density up to 500 W/cm², available upon request.
FAQs – High Power Thermal Test Vehicle (TTV)
1. What is a High Power TTV?
A High Power Thermal Test Vehicle (TTV) is a test chip designed to generate controlled heat loads, helping engineers evaluate thermal performance of cooling systems before using real processors.
2. What power options are available?
Standard models range from 500 W to 3,000 W, with customization up to 10,000 W. Power, voltage, and resistance can be tailored to application needs.
3. What cooling methods are supported?
TTVs can be tested with air cooling, liquid cooling, cold plates, immersion cooling, and hybrid systems.
4. Why use a TTV?
TTVs allow safe, repeatable, and cost-effective thermal testing, reducing risks and improving design validation before real CPUs/GPUs are deployed.
5. Can the TTV be customized?
Yes. KLC engineers can adjust voltage, current, heater size, and connectors to match your testing environment.
6. What is the difference between TTV and TTE?
A TTV simulates single-chip heat loads, while a TTE aggregates multiple TTVs to emulate rack-level heat dissipation.
7. Who needs TTVs?
- IC designers: Evaluate chip layout and hotspot feasibility.
- Packaging houses: Test material thermal conductivity.
- System engineers: Validate total rack-level cooling capacity.
Accelerate Your Thermal Validation
Ready to test the limits of your next-generation cooling design?
Connect with our thermal engineering team for a custom TTV configuration that matches your power density, form factor, and validation needs.
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