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High-Power Thermal Test Vehicle (TTV) Chip
- Simulates AI Chips, HPC and High-Power CPUs
- Ideal for Immersion Cooling System Testing
- Cost-Effective Solution
- High-Precision Temperature Control
- Plug-and-Play Design
| Size A (mm) | Size B (mm) | Voltage(V) | Max. Power (W) | ||
| 50×50 | 50×50 | <200 | 2500 | ||
| 50×50 | 40×40 | <200 | 1600 | ||
| 50×50 | 30×30 | <200 | 900 | ||
| 50×50 | 20×20 | <200 | 400 |
Product Description
The High-Power Thermal Test Vehicle (TTV) Chip is an innovative product designed to simulate the thermal effects of the latest AI chips, HPC and high-power CPUs. With a single chip capable of reaching up to 2500W power output, it is perfect for testing the efficiency of immersion cooling systems. This product provides a precise thermal load, enabling accurate evaluation of cooling solutions without risking damage to costly AI chips, HPC or CPUs.
Designed with advanced semiconductor packaging requirements in mind, this thermal test chip offers plug-and-play compatibility with various PCB layouts, making it a valuable tool for labs and companies developing next-generation cooling technologies. Whether for research or practical application, the Cost-Saving High-Power Thermal Test Vehicle (TTV) Chip is the ideal solution for thermal testing in a cost-effective manner.
Key Features:
- Simulates AI Chips, HPCand High-Power CPUs: Capable of reaching up to 2500W power output, this chip is designed to simulate the thermal behavior of the latest AI chips, HPC and high-power CPUs.
- Ideal for Immersion Cooling System Testing: Specifically engineered for immersion cooling system testing, providing accurate thermal profiles to evaluate cooling efficiency.
- Cost-Effective Solution: By using this Thermal Test Vehicle (TTV) chip, labs can save costs by avoiding the use of expensive real AI chips and CPUs for testing purposes.
- High-Precision Temperature Control: Ensures precise thermal simulation suitable for advanced semiconductor packaging and cooling system testing environments.
- Plug-and-Play Design: Compatible with various PCB layouts, this test chip can be easily integrated into existing test platforms, reducing development cycles.
Specifications
| Size A (mm) | Size B (mm) | Voltage(V) | Max. Power (W) | ||
| 50×50 | 50×50 | <200 | 2500 | ||
| 50×50 | 40×40 | <200 | 1600 | ||
| 50×50 | 30×30 | <200 | 900 | ||
| 50×50 | 20×20 | <200 | 400 |
More Specifications, please contact us: info@ptc-heater.com.tw
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