Multi-Zone Power TTV (Thermal Test Vehicle) | KLC TTV 2.0

KLC TTV 2.0 Multi-Zone Power Thermal Test Vehicle for Next-Generation Processors, Chiplets, and AI Accelerators

–Updated July 2026 | Reviewed by Charles Wu, Founder & CTO — 40+ years of heating engineering experience

NEW | Patent Pending

Designed for AI Chip, CPU/GPU, Cold Plate, Liquid Cooling and Two-Phase Cooling Validation

As AI processors continue to evolve from monolithic chips to advanced heterogeneous architectures, heat generation has become increasingly non-uniform. Modern AI GPUs, CPUs, AI accelerators, Chiplet packages, and High Bandwidth Memory (HBM) create multiple localized hotspots that cannot be accurately represented by conventional single-zone thermal test devices.

 

The KLC TTV 2.0 Multi-Zone Thermal Test Vehicle is built on the next-generation KLC TTV 2.0 Standardized Platform, featuring Independent Power Zone Configuration, Custom Heating Patterns, Multi-Point Temperature Monitoring, and Integrated Controller Solutions.

It enables engineers to reproduce realistic thermal distributions for AI processors and validate the performance of Cold Plates, Liquid Cooling, Direct-to-Chip Cooling, Immersion Cooling, and Two-Phase Cooling systems with exceptional accuracy.

In the rapidly advancing semiconductor landscape of 2026, AI servers, high-performance computing (HPC), GPUs, and chiplet-based heterogeneous integrated circuits generate highly non-uniform heat profiles with intense hotspots from discrete functional blocks like GPU cores, AI accelerators, CPU chiplets, and memory controllers. Traditional single-zone thermal test vehicles fall short in replicating these real-world thermal behaviors.

KLC’s Multi-Zone Power Thermal Test Vehicle (TTV), developed by Taiwan-based KLC Corporation with over 40 years of expertise in PTC heating and advanced thermal control, delivers a highly customizable, independently controllable multi-zone solution. This enables engineers to precisely simulate complex, heterogeneous thermal distributions for accurate validation of cooling systems before committing to costly silicon prototypes.

 

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 Why Choose TTV 2.0 Multi-Zone Thermal Test Vehicle?

Today’s AI processors no longer generate heat uniformly.

Advanced semiconductor packaging technologies—including Chiplet architectures, heterogeneous integration, and HBM memory stacks—produce multiple high heat-flux regions across a single package. Traditional single-zone heaters cannot accurately reproduce these complex thermal profiles, often leading to discrepancies between laboratory testing and real-world operating conditions.

The KLC TTV 2.0 Multi-Zone Thermal Test Vehicle uses Independent Power Zones, allowing each heating zone to be configured individually for power output, power density, and temperature monitoring. This enables engineers to emulate realistic processor hotspot behavior and significantly improve the accuracy of thermal validation.

Benefits include:

• Higher thermal simulation accuracy
• Realistic hotspot emulation
• Independent power control for each zone
• Improved cooling system optimization
• Faster thermal design verification
• Reduced product development time

 

 

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Key Features

• Multi-Zone Power Configuration 

Supports 15, 25  independent power zones (customizable), allowing individual control of power, power density, and temperature for realistic AI processor hotspot simulation.

• Custom Power Zones

Power Zones are customized based on customer Power Map Layout to accurately emulate GPU, CPU, Chiplet, and HBM heat distributions.

• Flexible Sensor Configuration

Supports built-in T-Type thermocouples, optional RTD sensors, and customized sensor layouts for precise multi-point temperature monitoring.

• Integrated Controller System

Complete thermal validation solution including temperature control, power monitoring, and multi-zone controller for accurate testing.

• Adjustable AC Power Supply

Compatible with 110/220 VAC input and 0–260 VAC adjustable output, supporting multiple power ratings for different testing requirements.

• Adjustable Super High-Power Output

Supports adjustable thermal load and power density by simply varying the input voltage, enabling realistic simulation of high-power AI processors.

Available power density options include:

• • High Power: 150–300 W/cm²
  • Ultra High Power: 500–1,000+ W/cm² (Custom Project)

Ideal for thermal validation of:

• • AI Servers
  • GPUs
  • CPUs
  • OAM Modules
  • AI Accelerators

Designed for Cold Plate, Liquid Cooling, and  Two-Phase Cooling systems performance testing with precise temperature control and reliable thermal validation.

• Customization

Simply provide your zone layout, power density, voltage, dimensions, connectors, and sensor configuration,  and our engineering team will develop the optimal TTV solution.

Customization options include:

• • Dimensions & Thickness
  • Heating Zone Configuration
  • Multi-Zone Power Layout
  • Power Density
  • Operating Voltage
  • Temperature Controller & T-Type Sensors
  • Adjustable Power Supply
  • Mounting Fixture

          TTV 2.0 Multi-Zone Power TTV

Standard configurations typically include 15, 25 zones, with custom layouts available.

 

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Technical Advantages Over Single-Zone TTVs

 

• True thermal gradients & hotspots closer to real silicon
• Independent zone operation — Explore countless workload scenarios
• High reliability — Built for extreme densities beyond typical production needs
• Custom multi-zone hotspot designs for large-die simulation

 

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Primary Applications

The KLC TTV 2.0 Multi-Zone Thermal Test Vehicle is ideal for:

• AI Server Thermal Validation
• AI Processor Development
• GPU Hotspot Simulation
• CPU Thermal Characterization
• AI Accelerator Validation
• ASIC Thermal Testing
• Chiplet Thermal Validation
• HBM Cooling Evaluation
• Cold Plate Validation
• Liquid Cooling Performance Testing
• Direct-to-Chip Cooling Validation
• Two-Phase Cooling Validation
• Immersion Cooling Evaluation
• Semiconductor Thermal Characterization
• High Heat Flux Cooling Research

 

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Complete AI Thermal Validation Solution

Beyond the Multi-Zone Thermal Test Vehicle, KLC provides a complete thermal validation ecosystem, including:

• Multi-Zone Thermal Test Vehicle
• T-type Sensor
• Temperature Controller
• Multi-Zone Sensor
• Upper Clamp Plate
• Lower Clamp Plate
• Fixing Pressure Assembly
• Cold Plate Fixture
• Adjustable Power Supply

Together, these components establish a complete thermal validation platform for AI cooling development.

 

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Customizable Options

KLC provides full TTV customization to meet application-specific requirements:

• Custom dimensions (30 × 30 mm to 80 × 80 mm, or other sizes upon request) and Thickness
• Target power output
• Required power density (W/cm² or high-heat-flux design)
• Fixed or adjustable voltage configurations
• Integrated temperature sensor options (NTC, RTD, or thermocouple)
• Mounting, interface, and layout customization
• Application-specific thermal design (liquid cooling, heat pipe, cold plate, or AI server testing)

Simply provide your required heat load, voltage range, and mechanical constraints, and KLC’s engineering team will design the optimal TTV solution for your system.

 

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How to Select Your TTV

1. Determine Target Power Range and Operating Voltage
   Identify the thermal load and voltage required for your test scenario.
2. Specify Constraints and Requirements
   Include footprint size, heat flux, mounting, or sensor requirements.
3. Temperature Monitoring Needs
   Specify if integrated temperature sensors are required.
4. Receive Engineering Recommendation
   KLC will recommend the best-fit TTV configuration and provide a complete technical specification sheet for your validation needs.

This approach ensures accurate chip heat simulation, high thermal reliability, and repeatable cooling system evaluation.

 

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Why Multi-Zone Matters

Modern AI processors generate highly localized heat due to advanced packaging technologies such as Chiplet architectures, HBM integration, and heterogeneous computing.

Compared with conventional single-zone heaters, Multi-Zone Thermal Test Vehicles reproduce realistic thermal distributions, allowing engineers to evaluate cooling solutions with greater accuracy.

This improves:

• Cold Plate Optimization
• Thermal Resistance Measurement
• Cooling Performance Analysis
• AI Server Reliability
• Thermal Design Verification

 

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Available Power–Voltage Configurations

12V~600V Super High-Power Thermal Test Vehicle (TTV)

Dimensions (mm)	Adjustable Voltage (V)	Power Range (W)	Maximum Current (A)
30 x 30	12 ~ 48	5 ~ 280	6
30 x 30	24 ~ 80	15 ~ 800	10
30 x 30	48 ~ 120	20 ~ 1600	15
30 x 30	80 ~ 200	50 ~ 2000	16
30 x 30	120 ~ 250	100 ~ 2000	16
30 x 30	200 ~ 400	300 ~ 2000	7
30 x 30	250 ~ 600	450 ~ 2000	7
35 x 35	12 ~ 48	5 ~ 400	10
35 x 35	24 ~ 80	15 ~ 1000	14
35 x 35	48 ~ 120	30 ~ 2000	20
35 x 35	80 ~ 200	100 ~ 2200	20
35 x 35	120 ~ 250	200 ~ 2500	12
35 x 35	200 ~ 400	500 ~ 2500	8
35 x 35	250 ~ 600	750 ~ 2500	6
40 x 40	12 ~ 48	5 ~ 380	8
40 x 40	24 ~ 80	20 ~ 1000	13
40 x 40	48 ~ 120	60 ~ 2000	19
40 x 40	80 ~ 200	80 ~ 2400	20
40 x 40	120 ~ 250	200 ~ 3000	16
40 x 40	200 ~ 400	500 ~ 3200	11
40 x 40	250 ~ 600	800 ~ 3200	11
50 x 50	12 ~ 48	10 ~ 380	8.0
50 x 50	24 ~ 80	25 ~ 1000	13.3
50 x 50	48 ~ 120	60 ~ 1600	17
50 x 50	80 ~ 200	150 ~ 2500	15
50 x 50	120 ~ 250	300 ~ 4000	19
50 x 50	200 ~ 400	850 ~ 4500	10
50 x 50	250 ~ 600	1400 ~ 5000	11
60 x 60	12 ~ 48	10 ~ 280	6
60 x 60	24 ~ 80	20 ~ 800	10
60 x 60	48 ~ 120	80 ~ 1800	15
60 x 60	80 ~ 200	200 ~ 2400	13
60 x 60	120 ~ 250	450 ~ 3600	15
60 x 60	200 ~ 400	1300 ~ 4600	12
60 x 60	250 ~ 600	2000 ~ 5000	12.5
80 x 80	12 ~ 48	10 ~ 450	10
80 x 80	24 ~ 80	20 ~ 1200	16
80 x 80	48 ~ 120	80 ~ 2000	20
80 x 80	80 ~ 200	200 ~ 3000	19
80 x 80	120 ~ 250	400 ~ 4000	21
80 x 80	200 ~ 400	1200 ~ 6000	19
80 x 80	250 ~ 600	1800 ~ 8000	15

110V / 220V Super High-Power Thermal Test Vehicle (TTV)

Voltage (V)	Dimensions (mm)	Selectable Power (W)
110	30 x 30	80, 260, 1500
110	35 x 35	130, 550, 2100
110	40 x 40	150, 400, 2000
110	50 x 50	250, 500, 2000
110	60 x 60	360, 740, 1500
110	80 x 80	320, 660, 2400
220	30 x 30	320, 1000
220	35 x 35	540, 2200
220	40 x 40	600, 1600
220	50 x 50	1000, 2000
220	60 x 60	1500, 3000, 6000
220	80 x 80	1300, 2600, 9600

We can tailor your TTV based on:

• Custom dimensions (30 × 30 mm up to 80 × 80 mm, or other sizes upon request)
• Target power rating
• Required power density
• Fixed or adjustable voltage
• Integrated temperature sensor options
• Mounting, interface, and layout customization
• Application-specific thermal design

Simply share your required heat load, voltage, and mechanical constraints, and our engineering team will design the optimal TTV for your system.

 

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Frequently Asked Questions (FAQ) – Multi-Zone TTV

 

Q1. What is the difference between a Multi-Zone TTV and a standard TTV?

A standard TTV provides a uniform heat source with a single power output. In contrast, a Multi-Zone TTV allows independent control of power and power density in each heating zone, making it ideal for simulating the non-uniform heat distribution of GPUs, CPUs, Chiplet architectures, HBM packages, and AI accelerators.

Q2. How many heating zones can be configured?

KLC offers standard configurations with 15-zone and 25-zone layouts. Additional custom zone configurations can be designed based on your processor architecture, thermal map, and testing requirements.

Q3. Can KLC provide the controller and monitoring system?

Yes. KLC provides a complete thermal validation solution, including multi-zone controllers, multi-point temperature monitoring, and adjustable power supplies for accurate thermal testing.

Q4. Can RTD or other temperature sensors be integrated?

Yes. The Multi-Zone TTV supports K-Type, T-Type thermocouples, RTD sensors, and other customized sensor configurations based on your application requirements.

Q5. What cooling systems can the Multi-Zone TTV validate?

The Multi-Zone TTV is designed for thermal validation of:

• Cold Plate Cooling
• Liquid Cooling
• Two-Phase Cooling
• AI Servers
• GPUs
• CPUs
• AI Accelerators

Q6. Does the Multi-Zone TTV support temperature monitoring?

Yes. Optional integrated multi-point temperature sensors can be installed in each heating zone to provide real-time temperature feedback during thermal validation.

Q7. Are mounting fixtures available?

Yes. KLC provides standard mounting fixtures, including the Upper Clamp Plate, Lower Clamp Plate, and Fixing Pressure Assembly, supporting both R&D validation and production-level testing.

Q8. Is the Multi-Zone TTV suitable for Cold Plate and Liquid Cooling validation?

Yes. The Multi-Zone TTV is specifically designed for high heat-flux validation of Cold Plate, Liquid Cooling, and Two-Phase Cooling systems, delivering accurate and repeatable thermal performance evaluation.

Q9. What is the typical lead time?

Approximately 6–8 weeks, depending on project complexity.

 

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Ready to Advance Your Thermal Validation?

With KLC Corporation’s proven 40+ years in PTC thermal expertise and leadership in high-power TTVs for AI/HPC, partner with a trusted Taiwan innovator for reliable, precise results.

Contact our engineering team today to discuss your requirements — we’ll deliver the optimal Multi-Zone Power TTV configuration tailored to your chiplet, AI accelerator, GPU, or liquid-cooled project.

Email: info@ptc-heater.com.tw

KLC Thermal Test Vehicles — Precision, realistic thermal simulation powering the future of semiconductors.

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