Multi-Zone Power TTV (Thermal Test Vehicle)

KLC Multi-Zone Power Thermal Test Vehicle (TTV) for Next-Generation Processors, Chiplets, and AI Accelerators

–  Last updated: January 2026 Reviewed by KLC Thermal Solutions Engineering Team

In the rapidly advancing semiconductor landscape of 2026, AI servers, high-performance computing (HPC), GPUs, and chiplet-based heterogeneous integrated circuits generate highly non-uniform heat profiles with intense hotspots from discrete functional blocks like GPU cores, AI accelerators, CPU chiplets, and memory controllers. Traditional single-zone thermal test vehicles fall short in replicating these real-world thermal behaviors.

KLC’s Multi-Zone Power Thermal Test Vehicle (TTV), developed by Taiwan-based KLC Corporation with over 40 years of expertise in PTC heating and advanced thermal control, delivers a highly customizable, independently controllable multi-zone solution. This enables engineers to precisely simulate complex, heterogeneous thermal distributions for accurate validation of cooling systems before committing to costly silicon prototypes.

 

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Why Engineering Teams Choose KLC Multi-Zone Power TTV in 2026

Modern chips demand realistic non-uniform power mapping to address thermal gradients, coupling effects, and spreading challenges. KLC’s multi-zone design provides:

• Realistic non-uniform power distribution simulation — Highly replicating real silicon thermal maps
• Full independent zone control — Test scenarios from idle to peak loads across different blocks
• Ultra-high power density — Meeting extreme demands of next-gen AI and HPC
• Dynamic & transient simulation — Real-time power adjustments for workload variations
• Optimized for liquid cooling, heatsink, OAM, and TIM validation — Ensures reliable results under production-level conditions

This outperforms single-zone alternatives by delivering predictive, actionable thermal data that accelerates development while reducing risks.

 

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Key Features  

• Multi-Zone Hotspot Precision
  Custom layouts (standard 2, 4, 6 zones; fully bespoke available) for advanced processors and accelerators
• Adjustable Super High Power Output
  Voltage-tunable for wide thermal loads, from low to extreme watts
• Wide Thermal Load Range
  Covers demands for AI accelerators, OAM modules, and high-power GPU testing
  
• Liquid/Immersion Cooling Ready
  Designed for water/liquid cold plates and full immersion systems
• Customization:
  • Sizes: 30×30 mm to 80×80 mm (or custom)
  • Power & Heat Flux: Tailored to your specs
  • Voltage: Fixed (110V/220V) or adjustable 12–600V
  • Optional Integrated Sensors: Real-time per-zone temperature monitoring (or custom)
  • Mechanical: Custom fixtures, sockets, and mounting for seamless integration
  • Safety: Recommend low-power startup with gradual ramp-up

          Multi-Zone Power TTV

Standard configurations typically include 2, 4, or 6 zones, with custom layouts available.

 

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Technical Advantages Over Single-Zone TTVs

 

• True thermal gradients & hotspots closer to real silicon
• Independent zone operation — Explore countless workload scenarios
• High reliability — Built for extreme densities beyond typical production needs
• Custom multi-zone hotspot designs for large-die simulation

 

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Primary Applications

• Chiplet Architecture Thermal Analysis — Validate thermal management in multi-die, disaggregated designs
• AI Accelerator Characterization — Test cooling for high-density tensor/AI processing units
• GPU Thermal Validation — Multi-core graphics processor hotspot behavior
• TIM Performance Testing — Evaluate thermal interface materials under realistic, non-uniform loads
• Cooling Solution Development — Optimize heatsinks, cold plates, and advanced cooling for complex heat sources

 

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Customizable Options

KLC provides full TTV customization to meet application-specific requirements:

• Custom dimensions (30 × 30 mm to 80 × 80 mm, or other sizes upon request)
• Target power output
• Required power density (W/cm² or high-heat-flux design)
• Fixed or adjustable voltage configurations
• Integrated temperature sensor options (NTC, RTD, or thermocouple)
• Mounting, interface, and layout customization
• Application-specific thermal design (liquid cooling, heat pipe, cold plate, or AI server testing)

Simply provide your required heat load, voltage range, and mechanical constraints, and KLC’s engineering team will design the optimal TTV solution for your system.

 

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How to Select Your TTV

1. Determine Target Power Range and Operating Voltage
   Identify the thermal load and voltage required for your test scenario.
2. Specify Constraints and Requirements
   Include footprint size, heat flux, mounting, or sensor requirements.
3. Temperature Monitoring Needs
   Specify if integrated temperature sensors are required.
4. Receive Engineering Recommendation
   KLC will recommend the best-fit TTV configuration and provide a complete technical specification sheet for your validation needs.

This approach ensures accurate chip heat simulation, high thermal reliability, and repeatable cooling system evaluation.

 

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Available Power–Voltage Configurations

12V~600V Super High-Power Thermal Test Vehicle (TTV)

Dimensions (mm)	Adjustable Voltage (V)	Power Range (W)	Maximum Current (A)
30 x 30	12 ~ 48	5 ~ 280	6
30 x 30	24 ~ 80	15 ~ 800	10
30 x 30	48 ~ 120	20 ~ 1600	15
30 x 30	80 ~ 200	50 ~ 2000	16
30 x 30	120 ~ 250	100 ~ 2000	16
30 x 30	200 ~ 400	300 ~ 2000	7
30 x 30	250 ~ 600	450 ~ 2000	7
35 x 35	12 ~ 48	5 ~ 400	10
35 x 35	24 ~ 80	15 ~ 1000	14
35 x 35	48 ~ 120	30 ~ 2000	20
35 x 35	80 ~ 200	100 ~ 2200	20
35 x 35	120 ~ 250	200 ~ 2500	12
35 x 35	200 ~ 400	500 ~ 2500	8
35 x 35	250 ~ 600	750 ~ 2500	6
40 x 40	12 ~ 48	5 ~ 380	8
40 x 40	24 ~ 80	20 ~ 1000	13
40 x 40	48 ~ 120	60 ~ 2000	19
40 x 40	80 ~ 200	80 ~ 2400	20
40 x 40	120 ~ 250	200 ~ 3000	16
40 x 40	200 ~ 400	500 ~ 3200	11
40 x 40	250 ~ 600	800 ~ 3200	11
50 x 50	12 ~ 48	10 ~ 380	8.0
50 x 50	24 ~ 80	25 ~ 1000	13.3
50 x 50	48 ~ 120	60 ~ 1600	17
50 x 50	80 ~ 200	150 ~ 2500	15
50 x 50	120 ~ 250	300 ~ 4000	19
50 x 50	200 ~ 400	850 ~ 4500	10
50 x 50	250 ~ 600	1400 ~ 5000	11
60 x 60	12 ~ 48	10 ~ 280	6
60 x 60	24 ~ 80	20 ~ 800	10
60 x 60	48 ~ 120	80 ~ 1800	15
60 x 60	80 ~ 200	200 ~ 2400	13
60 x 60	120 ~ 250	450 ~ 3600	15
60 x 60	200 ~ 400	1300 ~ 4600	12
60 x 60	250 ~ 600	2000 ~ 5000	12.5
80 x 80	12 ~ 48	10 ~ 450	10
80 x 80	24 ~ 80	20 ~ 1200	16
80 x 80	48 ~ 120	80 ~ 2000	20
80 x 80	80 ~ 200	200 ~ 3000	19
80 x 80	120 ~ 250	400 ~ 4000	21
80 x 80	200 ~ 400	1200 ~ 6000	19
80 x 80	250 ~ 600	1800 ~ 8000	15

110V / 220V Super High-Power Thermal Test Vehicle (TTV)

Voltage (V)	Dimensions (mm)	Selectable Power (W)
110	30 x 30	80, 260, 1500
110	35 x 35	130, 550, 2100
110	40 x 40	150, 400, 2000
110	50 x 50	250, 500, 2000
110	60 x 60	360, 740, 1500
110	80 x 80	320, 660, 2400
220	30 x 30	320, 1000
220	35 x 35	540, 2200
220	40 x 40	600, 1600
220	50 x 50	1000, 2000
220	60 x 60	1500, 3000, 6000
220	80 x 80	1300, 2600, 9600

We can tailor your TTV based on:

• Custom dimensions (30 × 30 mm up to 80 × 80 mm, or other sizes upon request)
• Target power rating
• Required power density
• Fixed or adjustable voltage
• Integrated temperature sensor options
• Mounting, interface, and layout customization
• Application-specific thermal design

Simply share your required heat load, voltage, and mechanical constraints, and our engineering team will design the optimal TTV for your system.

 

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Frequently Asked Questions (FAQ) – Multi-Zone TTV

Q: How many zones are possible? Standard: 2, 4, or 6 zones.
A: Custom layouts available for your specific chip map.

Q: Does it support dynamic/transient testing?
A: Yes — the control interface allows real-time power changes to mimic actual computational workloads.

Q: Are temperature sensors included?
A: Optional integrated thermal sensors provide real-time feedback per zone.

Q: What about mounting?
A: Standard sockets plus fully custom fixtures to fit your test setup.

Q: Typical lead time?
A: 4–6 weeks for standards; 6–8 weeks for customs.

 

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Ready to Advance Your Thermal Validation?

With KLC Corporation’s proven 40+ years in PTC thermal expertise and leadership in high-power TTVs for AI/HPC, partner with a trusted Taiwan innovator for reliable, precise results.

Contact our engineering team today to discuss your requirements — we’ll deliver the optimal Multi-Zone Power TTV configuration tailored to your chiplet, AI accelerator, GPU, or liquid-cooled project.

Email: info@ptc-heater.com.tw

KLC Thermal Test Vehicles — Precision, realistic thermal simulation powering the future of semiconductors.

Start your project now and optimize thermal performance from design to deployment!