Super High-Power TTV with Heatsink (Custom)

The Future of Thermal Validation

High-Efficiency Heat Exchange Simulation Platform for AI, GPU, and HPC Development

–  Last updated: January 2026 Reviewed by KLC Thermal Solutions Engineering Team

The Super High-Power TTV with Integrated Heatsink by KLC is a specialized thermal testing solution where the heating element is directly integrated into the heatsink or cold plate structure.

By eliminating the thermal interface material (TIM) variables, this innovative design allows engineers to test complete thermal solutions under realistic operating conditions. It is the gold standard for validating AI servers, OAM (OCP Accelerator Modules), and high-density liquid cooling systems.

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• Maximum Power: Up to 12,800W.
• Key Innovation: Direct structural integration eliminates interface resistance.
• Cooling Compatibility: Air-Cooled, Liquid-Cooled Cooling or in power electronics cooling.

Key Features

• TTV with Integrated Heatsink (One-Piece Design)
  Zero-Variable Path: Eliminates Thermal Interface Material (TIM) variables, ensuring maximum measurement accuracy.
• Extreme High-Power Density for AI & HPC
  Supports up to 12,800 W total power and 500 W/cm² heat flux for AI server, GPU, and HPC thermal validation. 
• Customization
  
  • Mechanical: Base sizes from 30×30mm to 80×80mm (or Custom)
  • Electrical: Adjustable voltage (12V–600V) or fixed (110V/220V) configurations.
  • Sensors: Integrated Temperature Sensors for precise thermal mapping.
  • Heatsink fin designs tailored for Air, Liquid, or in power electronics cooling. 
• Embedded Thermal Sensors
  Multi-point sensors enable real-time thermal mapping from heater to fins. 
• Rapid Deployment:
  Pre-assembled with UL-certified leads; includes 3D STEP files for seamless CFD correlation.

Why Choose Integrated Heatsink Design?

Traditional testing uses separate dummy heaters/TTVs and sinks, which introduces TIM uncertainty. Our integrated solution solves this:

1. Direct Thermal Path: Direct copper-to-heatsink contact ensures maximum transfer efficiency.
2. Realistic Simulation: Closely mimics actual chip-to-cooler performance in production systems.
3. Zero Assembly Variables: No mounting pressure or TIM application issues; ready to test out of the box.
4. Advanced Cooling Support: Optimized for Advanced high-flow Air Cooling and Liquid Cooling.

Technical Specifications Summary

CFD Support: KLC provides 3D STEP files and detailed thermal characteristics for seamless integration into your simulation software.

Application Scenarios

• AI Server Thermal Testing: Validate OAM and GPU cooling solutions under extreme heat loads.
• Liquid Cooling Development: Characterize cold plate flow distribution and pressure drop.
• Air Cooling Validation: Optimize fin geometries for heat transfer in dielectric fluids.
• Design Verification (DVT): Perform repeatable stress tests without the cost and risk of using actual chips.

How to Select Your TTV with Heatsink

To provide the optimal solution, KLC engineers work with you through four steps:

1. Define Cooling Method: Air, Liquid, or high power electronics Cooling?
2. Specify Power Requirements: Target wattage and power density.
3. Define Fin Configuration: Height, spacing, and pattern based on flow requirements.
4. Sensor Integration: Determine placement for temperature monitoring and thermal mapping.
5. Thermal Resistance (K/W): Measures heat dissipation
6. Dimensions & Zones: Custom zones for precise hotspot simulation.

Frequently Asked Questions (FAQ)

Q: Can the fins be made with copper/aluminum hybrid construction?
A: Yes. A copper base provides excellent heat spreading, while aluminum fins offer cost-effective and lightweight surface area.

Q: Is this TTV suitable for two-phase immersion cooling?
A: Absolutely. Our materials and surface treatments are compatible with common dielectric fluids used in two-phase systems.

Q1: Is the heatsink integrated into the TTV?
A: Yes. This is a true one-piece TTV with an integrated heatsink. That means no TIM layers, no mounting pressure issues, and highly repeatable thermal data.

Q2: Can I use this TTV for Liquid cooling validation?
A: Absolutely. The materials and surface treatments are tested for Liquid or Air-cooled servers safely.

Q3: What power levels can the integrated TTV simulate?
A: Up to 12,800 W total power and 500 W/cm² heat flux, ideal for AI GPUs, HPC accelerators, and full-node thermal validation.

Q4: Does the TTV include temperature sensors?
A: Yes. Multi-point sensors are optionally embedded for real-time mapping from the heater base to the fins.

Q5: Can you match our specific mounting hole pattern?
A: Absolutely. We can customize the mechanical base to match your existing brackets or standard OCP/OAM interfaces perfectly.

Q6: How do we start a custom TTV design?
A: Simply provide your target TDP and your cooling environment (Air, Liquid, or other cooling). Our engineers will deliver a draft configuration within days for evaluation.

Ready to Validate Your Cooling System?

We can tailor your TTV based on:

• Custom dimensions (30 × 30 mm up to 80 × 80 mm, or other sizes upon request)
• Target power rating
• Required power density
• Fixed or adjustable voltage
• Integrated temperature sensor options
• Mounting, interface, and layout customization
• Application-specific thermal design

Simply share your required heat load, voltage, and mechanical constraints, and our engineering team will design the optimal TTV for your system.

Partner with KLC for precision-engineered thermal test vehicles.

[Contact KLC Engineering Team] | [Request a Quote]

TEL: +886 (0)425330456 | Email: info@ptc-heater.com.tw