Thin Plate TTV (Thermal Test Vehicle)

Thin Plate TTV (Thermal Test Vehicle)-Unlocking High-Performance Thermal Validation

–  Reviewed by KLC Thermal Solutions Engineering Team,  updated in Dec 2025 ·

KLC’s Thin Plate Thermal Test Vehicle (TTV) series is designed for engineers, R&D teams, and thermal management specialists who need precise, repeatable, and adjustable thermal loading. It is ideal for:

• Chip heat simulation and hotspot analysis
• CPU, GPU and AI accelerator thermal validation
• High-power electronic cooling system testing
• Data center and server thermal benchmarking
• Laboratory and engineering platform applications

The TTV allows users to accurately control the heat load by adjusting input voltage, supporting a wide range of low-power to high-heat-flux scenarios. Compatible with adjustable DC power supplies, it ensures safe stepwise voltage increases to achieve the target thermal load, replicating real-world operating conditions.

Optional integrated temperature sensors provide real-time monitoring, enabling temperature control, system stability evaluation, and thermal reliability testing.

 

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Key Features

• Adjustable Power Output

Easily tune the input voltage to set the exact heat load required for your test scenario, ideal for thermal R&D, cooling efficiency assessment, and controlled heat source simulation.

• Wide Power Range

Supports scenarios from low-power calibration to high-density heat flux, covering all common chip, module, and system thermal validation needs.

• Simple and Safe Operation

Start at low voltage and gradually increase output to reach the target wattage. This ensures stable, repeatable, and safe thermal testing, even under high-power conditions.

• Optional Integrated Temperature Sensor

Provides real-time temperature feedback, enabling precise control and thermal reliability monitoring. Specify sensor requirements at the inquiry stage.

• Flexible Size Options (30 × 30 mm to 80 × 80 mm)

Multiple standard footprints are available. Custom dimensions can be designed to simulate specific chip sizes, AI accelerators, GPU dies, or localized heat sources.

 

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Customizable Options

KLC provides full TTV customization to meet application-specific requirements:

• Custom dimensions (30 × 30 mm to 80 × 80 mm, or other sizes upon request)
• Target power output
• Required power density (W/cm² or high-heat-flux design)
• Fixed or adjustable voltage configurations
• Integrated temperature sensor options (NTC, RTD, or thermocouple)
• Mounting, interface, and layout customization
• Application-specific thermal design (liquid cooling, heat pipe, cold plate, or AI server testing)

Simply provide your required heat load, voltage range, and mechanical constraints, and KLC’s engineering team will design the optimal TTV solution for your system.

 

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How to Select Your TTV

1. Determine Target Power Range and Operating Voltage
   Identify the thermal load and voltage required for your test scenario.
2. Specify Constraints and Requirements
   Include footprint size, heat flux, mounting, or sensor requirements.
3. Temperature Monitoring Needs
   Specify if integrated temperature sensors are required.
4. Receive Engineering Recommendation
   KLC will recommend the best-fit TTV configuration and provide a complete technical specification sheet for your validation needs.

This approach ensures accurate chip heat simulation, high thermal reliability, and repeatable cooling system evaluation.

 

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Available Power–Voltage Configurations

Thin Plate TTV (Thermal Test Vehicle): 12V~600V

Dimensions (mm)	Adjustable Voltage (V)	Power Range (W)	Maximum Current (A)
30 x 30	12 ~ 48	5 ~ 280	6.0
30 x 30	24 ~ 80	15 ~ 600	8.6
30 x 30	48 ~ 120	20 ~ 600	8.6
30 x 30	80 ~ 200	50 ~ 600	3.6
30 x 30	120 ~ 250	100 ~ 600	3.6
30 x 30	200 ~ 400	300 ~ 600	2.0
30 x 30	250 ~ 600	450 ~ 600	2.0
35 x 35	12 ~ 48	10 ~ 400	8.3
35 x 35	24 ~ 80	30 ~ 800	12
35 x 35	48 ~ 120	30 ~ 800	12
35 x 35	80 ~ 200	80 ~ 880	4.5
35 x 35	120 ~ 250	200 ~ 900	4.5
35 x 35	200 ~ 400	500 ~ 900	3.2
35 x 35	250 ~ 600	750 ~ 900	3.2
40 x 40	12 ~ 48	5 ~ 380	8
40 x 40	24 ~ 80	20 ~ 1000	12.5
40 x 40	48 ~ 120	80 ~ 1000	12.5
40 x 40	80 ~ 200	80 ~ 1000	5.6
40 x 40	120 ~ 250	200 ~ 1000	5.6
40 x 40	200 ~ 400	500 ~ 1000	3.6
40 x 40	250 ~ 600	800 ~ 1000	3.6
50 x 50	12 ~ 48	10 ~ 380	8.0
50 x 50	24 ~ 80	25 ~ 1050	13.3
50 x 50	48 ~ 120	60 ~ 1600	16.6
50 x 50	80 ~ 200	150 ~ 1600	8.0
50 x 50	120 ~ 250	300 ~ 1600	8.0
50 x 50	200 ~ 400	850 ~ 1800	6.0
50 x 50	250 ~ 600	1300 ~ 2000	6.5
60 x 60	12 ~ 48	10 ~ 280	6.0
60 x 60	24 ~ 80	20 ~ 800	10.0
60 x 60	48 ~ 120	80 ~ 1800	15.0
60 x 60	80 ~ 200	200 ~ 2000	11.1
60 x 60	120 ~ 250	450 ~ 2000	8
60 x 60	200 ~ 400	1300 ~2400	8.7
60 x 60	250 ~ 600	2000 ~ 2400	8.7
80 x 80	12 ~ 48	10 ~ 450	9.6
80 x 80	24 ~ 80	20 ~ 1200	16.0
80 x 80	48 ~ 120	80 ~ 2200	19.7
80 x 80	80 ~ 200	200 ~ 2200	18.2
80 x 80	120 ~ 250	400 ~ 3450	13.1
80 x 80	200 ~ 400	1200 ~ 4200	10.6
80 x 80	250 ~ 600	1900 ~ 4200	10.6

Thin Plate TTV (Thermal Test Vehicle): 110V/ 220V

Voltage (V)	Dimensions (mm)	Selectable Power
110	30 x 30	80, 260
110	35 x 35	130, 550
110	40 x 40	150, 400
110	50 x 50	250, 500
110	60 x 60	360, 740, 1500
110	80 x 80	320, 660, 2400
220	30 x 30	320
220	35 x 35	540
220	40 x 40	600
220	50 x 50	1,000
220	60 x 60	1,500
220	80 x 80	1300, 2600

We can tailor your TTV based on:

• Custom dimensions (30 × 30 mm up to 80 × 80 mm, or other sizes upon request)
• Target power rating
• Required power density
• Fixed or adjustable voltage
• Integrated temperature sensor options
• Mounting, interface, and layout customization
• Application-specific thermal design

Simply share your required heat load, voltage, and mechanical constraints, and our engineering team will design the optimal TTV for your system.

 

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Frequently Asked Questions (FAQ) – Thin Plate TTV

Q1: What is a Thin Plate TTV?

A Thin Plate Thermal Test Vehicle (TTV) is a precision thermal load module that simulates chip or system-level heat generation for cooling system validation, hotspot testing, and thermal reliability assessment.

Q2: How do I control the power output?

The TTV’s heat output is adjustable via input voltage. Start at low voltage and gradually increase to reach the target thermal load safely.

Q3: What is the power range of the Thin Plate TTV?

The TTV supports low-power to high-density heat flux applications, covering a wide range of thermal validation needs. Custom power ranges are available upon request.

Q4: Can I monitor the temperature during testing?

Yes. Optional integrated temperature sensors provide real-time thermal feedback for precise control and system safety.

Q5: What sizes are available?

Standard sizes range from 30 × 30 mm up to 80 × 80 mm, and custom dimensions can be designed to match specific chips or localized heat sources.

Q6: Can the TTV be customized?

Absolutely. KLC offers full customization including dimensions, target power, power density, voltage type, sensor options, mounting interfaces, and application-specific thermal design.

Q7: How do I select the right TTV for my project?

Identify the target power range, operating voltage, and thermal requirements. Specify if temperature monitoring is needed. KLC’s engineering team will recommend the optimal configuration and provide a complete specification sheet.

Q8: Which applications are ideal for the Thin Plate TTV?

• AI accelerators , CPU and GPU thermal testing
• Data center cooling performance validation
• High-power electronics heat management
• Laboratory thermal simulations and R&D
• Heat sink, vapor chamber, and cold plate testing

 

Ready to Configure Your TTV?

Choose between 110V and 220V models or request a custom thermal test solution.
Our team will help you select the optimal configuration for your power and cooling validation needs.

Contact Our Engineering Team