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TTV 2.0 Standardized Thermal Test Vehicle for AI Server, GPU & Cold Plate Validation
New | Patent Pending
TTV 2.0 is KLC’s next-generation Standardized Thermal Test Vehicle (TTV) — a Complete AI Chip Thermal Test Platform for AI Server Cooling Validation, GPU Thermal Validation Solution, CPU Thermal Simulation Module, and Cold Plate Performance Validation.
- Standardized dimensions for fast delivery
- Fast lead time
- 100% Built-in T-type Temperature Sensor
- Ultra-high flatness surface (Ra < 0.4 µm)
- Low Thermal Resistance structure
- Complete Thermal Validation Platform
| Standard Size (mm) | Adjustable Voltage (V) | Max Current (A) | Max Power (W) |
|---|---|---|---|
| 30 × 30 | 12–600 | 15.0 | 2000 |
| 35 × 35 | 12–600 | 21.0 | 2500 |
| 40 × 40 | 12–600 | 14.0 | 3200 |
| 50 × 50 | 12–600 | 10.4 | 5000 |
| 60 × 60 | 12–600 | 12.5 | 5000 |
| 80 × 80 | 12–600 | 50.6 | 8000 |
Product Description
TTV 2.0 — Standardized Thermal Test Vehicle : Next-Gen Thermal Solution for AI Servers, GPUs & DPUs
NEW | Patent Pending
Updated July 2026 | Reviewed by Charles Wu, Founder & CTO — 40+ years of heating engineering experience
Designed for AI Chip, CPU/GPU, Cold Plate, Liquid Cooling and Two-Phase Cooling Validation
TTV 2.0 is KLC’s next-generation Standardized Thermal Test Vehicle — a Complete AI Chip Thermal Test Platform designed for Thermal Validation Solution for AI Server, GPU Thermal Validation Solution, CPU Thermal Simulation Module, Cold Plate Performance Validation, and Liquid Cooling Validation Platform applications.
Unlike fully customized TTV solutions, TTV 2.0 combines standardized dimensions, standardized thicknesses, and a modular platform architecture. This allows engineers to significantly reduce development costs and shorten lead times while maintaining high-precision thermal simulation capability and full customization flexibility.
TTV 2.0 features a Low Thermal Resistance structure design, High Thermal Conductivity machining, and 100% Built-in T-Type Sensor Thermal Test capability. As a Complete Thermal Validation Platform, TTV 2.0 accurately simulates the thermal behavior of AI processors, CPUs, GPUs, and other high-power semiconductor devices — enabling engineers to validate cold plates, liquid cooling systems, and two-phase cooling solutions.
TTV 2.0 is Ideal For:
- Thermal Validation Solution for AI Server
- GPU Thermal Validation Solution
- CPU Thermal Simulation Module
- Cold Plate Performance Validation
- Liquid Cooling Validation Platform
- Semiconductor Thermal Validation Platform
Request Datasheet · Request STEP / CAD Files · Contact Engineering Team
At a Glance
TTV 2.0 is KLC’s next-generation standardized Thermal Test Vehicle platform developed for AI processors, GPUs, CPUs, and advanced liquid-cooling validation. Compared with conventional custom TTVs, TTV 2.0 provides standardized dimensions, faster delivery, a patent-pending low-thermal-resistance structure, Ultra-flat surfaces (Ra < 0.4 μm) for minimized contact thermal resistance and optimal heat transfer efficiency. 100% built-in T-type temperature sensors, and a complete thermal validation solution for AI server development.
AI Computing Is Driving New Thermal Challenges
The rapid growth of artificial intelligence (AI), high-performance computing (HPC), and next-generation data centers has dramatically increased processor power density. Modern GPUs and AI accelerators can dissipate hundreds of watts within compact packages. As thermal management evolves from conventional air cooling to liquid cooling, direct-contact cold plates, immersion cooling, and two-phase cooling, thermal validation has become an indispensable stage in product development.
Precise thermal simulation enables engineers to evaluate cooling efficiency, optimize thermal interface materials (TIM), compare cold plate designs, and verify system reliability before volume production. TTV 2.0 was developed to support these demanding thermal validation applications as a dedicated High Precision Thermal Test Vehicle and Semiconductor Thermal Validation Platform.
Why TTV 2.0?
As AI servers, HPC platforms, and high-power semiconductor devices continue to increase in power density, thermal validation becomes more challenging. Conventional fully customized Thermal Test Vehicles often require longer lead times, higher engineering costs, and repeated redesigns.
TTV 2.0 standardizes the Thermal Test Vehicle platform. With standardized dimensions, standardized thicknesses, and a modular architecture, engineers can significantly shorten development cycles while retaining the flexibility to customize heating patterns, power density, dimensions, and sensor configurations.
Key Benefits
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Standardized Platform
Standard dimensions and a modular architecture reduce lead time and engineering costs, while preserving customization flexibility.
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Optimal heat transfer efficiency
Ultra-flat surfaces (Ra < 0.4 μm) for more stable contact quality and heat transfer.
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Low Thermal Resistance
A new structural design lowers contact thermal resistance, bringing heat-flux distribution closer to real chip behavior.
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100% Built-in T-type Sensor
Every standard unit includes a factory-integrated T-type sensor for real-time, reliable temperature monitoring.
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Faster Lead Time
Standardized manufacturing accelerates the engineering validation cycle compared to fully custom builds.
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Custom Engineering Support
Adjustable on request: heating pattern, size, thickness, power density, and sensor configuration.
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Standard Heating Core Platform
A standardized heating core paired with customizable copper-block or ceramic housing — maintaining performance while shortening lead time and reducing cost versus a fully custom build.
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Production-Ready Mounting Solution
Upper/lower clamp plates, fixture, and cold-plate mounting are engineered as an integrated solution that scales from lab testing through pilot run and production — not just a one-off lab tool.
Multi-Zone Thermal Test Vehicle — Independent Power Configuration
To more accurately simulate the real thermal distribution of high-power chips including AI processors, GPUs, CPUs, ASICs, Chiplets, and HBM memory, TTV 2.0 supports Multi-Zone Thermal Test Vehicle configurations with independent power zone control.
As an AI Chip Hotspot Simulation and Non-Uniform Heat Distribution Simulation platform, TTV 2.0 enables precise replication of uneven thermal loads across the die.
Standard configurations available:
- 15-Zone Thermal Test Vehicle configuration
- 25-Zone Thermal Test Vehicle configuration
- Custom zone configurations available upon request
Each power zone is independently configurable for:
- Power (W)
- Power Density (W/cm²)
- Heating Pattern
- Temperature Monitoring
This enables more precise AI Chip Hotspot Simulation and Non-Uniform Heat Distribution Simulation for modern AI Processors, GPUs, CPUs, and high-power semiconductors — increasing the authenticity and reliability of your thermal validation results.
Custom Temperature Sensor Configuration:
In addition to the standard built-in T-Type sensors, KLC offers flexible sensor configuration options.
Available customizations include:
- Number of sensors
- Sensor placement positions
- Multi-point temperature monitoring
- Independent temperature measurement per power zone
Multi-point temperature feedback enables more complete analysis of thermal distribution and temperature variation under different cooling designs.
Contact our engineers to discuss your project! info@ptc-heater.com.tw
Traditional TTV vs. TTV 2.0
| Feature | Conventional TTV | TTV 2.0 |
|---|---|---|
| Design Approach | Fully Customized | Standardized + Customizable |
| Lead Time | Longer | Faster |
| Development Cost | Higher | Lower |
| Dimensions | Custom Every Project | Standard Sizes + Custom Options |
| Temperature Sensor | Optional | 100% Built-in T-type |
| Platform Architecture | Project-Based | Modular Platform |
Applications
- Thermal Validation Solution for AI Server (AI Server Cooling Validation)
- CPU Thermal Simulation Module (CPU Thermal Simulation)
- GPU Thermal Validation Solution (GPU Thermal Simulation)
- Cold Plate Performance Validation
- Liquid Cooling Validation Platform
- Two-Phase Cooling Validation
- Semiconductor Thermal Validation Platform
- Power Electronics Thermal Testing
- Thermal Test Fixture for CPU and GPU
Complete Thermal Validation Platform — One-Stop Solution
TTV 2.0 sits at the core of a complete thermal validation chain — from AI chip power profiles through controllers, thermal interface materials, cold plates, coolant distribution units (CDU), and data acquisition, all the way to final engineering analysis.
Fits Your Existing Cold-Plate Fixture
TTV 2.0 can be directly mounted with standard cold plate fixtures through KLC-provided clamping pressure assemblies and clamping plates, configured to match your CPU/GPU/AI Chip dimensions. Both thick and thin plate versions use the same assembly logic, with actual dimensions provided based on your fixture design.
The integrated clamping plates, fixtures, and cold plate mounting solution is an extensible system — supporting everything from laboratory testing through pilot production and volume manufacturing stages, not just a one-time lab tool.
In addition to providing TTV 2.0 thermal test modules, KLC can provide an integrated solution covering clamping plates, fixtures, and cold plate mounting — helping customers quickly establish a thermal validation platform that extends to production-stage CPU, GPU, and Cold Plate mounting modules.
We can provide the following based on your requirements:
- TTV 2.0 Thermal Test Module
- Clamping Plates (Cold Plate Clamping & Base Clamping Plates)
- Standard Clamping Assembly
- Cold Plate Integration Support
- Controller & Temperature Monitoring
- Engineering Design Support
Beyond R&D validation, KLC can also assist customers in designing and supplying Production Clamping Modules for CPU/GPU and Cold Plate, providing consistent clamping pressure and stable contact quality to improve assembly efficiency and product consistency.
Request Complete CAD Files to start your fixture design.
Technical Specifications
The following specifications represent the TTV 2.0 standard platform. Custom dimensions, thicknesses, heating zones, power density, and sensor configurations are available upon request.
| TTV 2.0 | Specification |
|---|---|
 |
TTV 2.0 Thick Plate
Standard Thickness: 8.5 mm |
 |
TTV 2.0 Thin Plate
Standard Thickness: 6.0 mm |
| Common Sizes | 30×30 / 35×35 / 40×40 / 60×60 / 80×80 mm |
| Temperature Sensor | 100% Built-in T-type Sensor (all standard products) |
| Surface Roughness | Ra < 0.4 µm (average Ra 0.16 µm) |
| Thickness Uniformity | Full-surface variation < 0.01 mm |
| Power Density (Standard Type) | < 150 W/cm² |
| Patent Status | Patent Pending (new structural design) |
Frequently Asked Questions
1. Can TTV 2.0 be customized?
Yes. Beyond the standard platform, KLC can customize dimensions, thickness, heating patterns, power density, and sensor configurations based on your test fixture requirements. Please contact our engineering team to discuss your needs.
2. Are STEP/CAD files available?
Yes. Contact our engineering team to request STEP or CAD files required for your fixture design.
3. Does TTV 2.0 support RTD integration?
Standard products include 100% built-in T-type thermocouple sensors. If your application requires RTD integration, please contact our engineering team to evaluate feasibility.
4. Is TTV 2.0 suitable for Liquid Cooling validation?
Yes. The platform is designed to support cold plate and liquid cooling system validation under real thermal load conditions.
5. Is TTV 2.0 compatible with Two-Phase Cooling systems?
Yes. TTV 2.0 supports performance evaluation of two-phase cooling systems under high heat flux density conditions.
6. Are controllers available?
Yes. KLC can provide controllers and monitoring equipment, including multi-point temperature and power monitoring, combined with TTV to form a complete thermal test solution.
7. Can the Heating Pattern be customized?
Yes. Heating patterns can be customized according to your Device Under Test (DUT) thermal distribution profile. Contact our engineering team to discuss zone configurations, or inquire about our Multi-Zone TTV product line for AI Chip Hotspot Simulation.
8. How do I choose between Thick Plate and Thin Plate TTV 2.0?
Thick Plate TTV (8.5 mm standard) is recommended for standard thermal tests and liquid cooling tests.
Thin Plate TTV (6.0 mm standard) is designed for space-constrained applications or special thermal interface requirements.
Please contact our R&D team to confirm the right version for your application. info@ptc-heater.com.tw
Start Your Thermal Validation Project Today
As a leading Thermal Test Vehicle Manufacturer Taiwan and dedicated Custom Thermal Test Vehicle Manufacturer, KLC not only provides Thermal Test Vehicles but also helps customers extend their validation platforms to production assembly.
Based on your CPU, GPU, AI Accelerator / NPU / ASIC, and Cold Plate design requirements, we can provide clamping plates, clamping pressure assemblies, and production clamping modules — helping you establish consistent and reliable assembly quality.
KLC provides a Complete Thermal Validation Platform including thermal test modules, controllers, monitoring systems, and engineering support, to accelerate your AI Server, CPU/GPU, Cold Plate, Liquid Cooling, and Two-Phase Cooling product development.
KLC Corporation
Your One-Stop Thermal Solution
We are always ready to help you and answer your questions.
More than 5,000 of our patented standard Ultra Thin Flexible Heaters are CSA, UL, CE recognized and REACH, RoHS compliant.
(cUL File Number: E315621 / CE: IEC60335-1:2010 & EC60335-1:2012)