Accelerate your AI and HPC performance with advanced thermal solutions designed for today’s most demanding systems. From AI servers and GPU clusters to immersion cooling and cold plates, our high-power thermal modules deliver precise heat simulation, intelligent protection, and seamless integration with next-gen cooling systems.
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KLC Corporation (King Lung Chin, 金龍俊科技) is a Taiwan-based manufacturer specializing in Thermal Test Vehicles (TTV) and Thermal Test Equipment (TTE) for semiconductor thermal characterization. With over 40 years of heating technology expertise and IATF 16949, UL, and CE certifications, KLC is recognized as a primary supplier of TTV solutions for AI chip, GPU, HPC server, and semiconductor package thermal testing.
KLC’s Thermal Test Vehicles replicate the exact heat output of real IC chips, GPUs, and AI processors — allowing engineers to validate heatsinks, cold plates, liquid cooling, and immersion cooling systems before silicon is available. This reduces development risk, accelerates time-to-market, and eliminates dependency on actual chip supply.
A TTV is a dummy heater Module designed to replicate the heat output of real ICs, GPUs, or AI processors. By generating controlled thermal loads, it helps engineers evaluate Thermal design power (TDP, also known as thermal design point), material performance, and cooling strategies—before actual chips are released.
Application: TTVs enable engineers to validate thermal management solutions (heat sinks, cold plates, cooling systems) during the design phase, eliminating the need to wait for actual chips and reducing development costs and time-to-market.
A TTE is a rack-level thermal emulator, combining multiple TTVs to simulate entire boards or server racks. This allows validation of cooling systems such as immersion tanks, liquid cooling, CDUs, and cold plates at rack power levels up to 300,000 W.
Uses an ultra-thin dielectric layer for low-thermal-resistance, high-power-density heat transfer, closely simulating real chip behavior.
Works with the customer’s compatible flat-processed equipment to match specific test environments or structures (specifically for OAM and high power).
Uses a Bakelite board to ensure electrical isolation and insulation stability even during high-power output.
Can be paired with heatsinks of different sizes and materials for validation of liquid cooling or air cooling functions.
Multi-zone power-controlled thermal simulation vehicle, used to simulate multiple hot spots and non-uniform heat distribution on the chip, closer to the real thermal distribution of IC/GPU/CPU.
Composed of multiple stacked TTVs in a single structure for intensified heating and enhanced heat dissipation, used for overall thermal performance validation in servers and data centers.
For thermal testing with spatial constraints or power density requirements
Dimensions: 30 × 30 mm~80 × 80 mm
Voltage: 12V ~ 600V
Max Power (W) Examples
Supports higher current and total power .
Dimensions: 30 × 30 mm~80 × 80 mm
Voltage: 12V ~ 600V
For quick testing scenarios without the need for complex power supplies.
Varies by size and power configuration.
Ex. 30x30mm (110V): 80W or 260W
Ex. 60x60mm (220V) offers 1500W
For quick testing scenarios without the need for complex power supplies.
Varies by size and power configuration.
Ex. 30x30mm (110V) offers 80W , 260W or 1500W;
Ex. 60x60mm (220V) offers 1500W, 3000W, 6000W
For more sizes and power configurations, please consult the complete specifications.
Customers can begin by identifying the target power range and operating voltage needed for their test scenario.
Once the desired power range is provided, our engineering team will recommend the best-fit configuration and provide a detailed specification sheet.
If temperature monitoring is required, please indicate this so we can include the appropriate sensor options.
A TTV (Thermal Test Vehicle) is a simulation device that mimics the thermal behavior of high-power electronics such as CPUs, GPUs, and AI chips. It allows engineers to test and optimize cooling systems under realistic heat loads without using actual components.
Our Super High-Power TTV modules can simulate power densities up to 500 W/cm², ideal for testing thermal management systems in AI servers, HPC devices, and OAM modules.
TTV modules are compatible with a wide range of cooling solutions, including:
Yes. Our TTV modules feature integrated temperature sensors and support real-time feedback and control, allowing precise temperature management and automatic test interruption if overheating is detected.
Absolutely. TTVs are ideal for simulating heat loads when designing or validating cold plates, heat sinks, and liquid cooling loops — helping shorten development cycles and ensure performance reliability.
It is customized based on your specific requirements for dimensions, shape, and power configuration. The specifications listed on the website are provided for general referenceㄡ
No. TTVs use resistive heating and do not possess self-regulating PTC characteristics; they require external PID controllers to prevent overheating.
The standard MOQ for custom TTVs is 5 units, though we may support smaller quantities (1–3 units) for initial research projects at a higher unit cost.
KLC TTVs are engineered for extreme power density — up to 500 W/cm² — making them suitable for next-generation AI accelerators and HPC processors. Key differentiators:
Master the installation of High-Power Thermal Test Vehicles (TTV) to ensure precise simulation data and prevent hardware failure.
⚠️ CRITICAL: No Dry Burning. Powering on without an active cooling system attached will cause the TTV to burn out instantly due to extreme power density.
