Accelerate your AI and HPC performance with advanced thermal solutions designed for today’s most demanding systems. From AI servers and GPU clusters to immersion cooling and cold plates, our high-power thermal modules deliver precise heat simulation, intelligent protection, and seamless integration with next-gen cooling systems.
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A TTV is a dummy heater Module designed to replicate the heat output of real ICs, GPUs, or AI processors. By generating controlled thermal loads, it helps engineers evaluate thermal conduction, material performance, and cooling strategies—before actual chips are released.
Single-Zone Power TTV – Uniform heating for standard thermal validation.
Multi-Zone Power TTV – Independent zones simulate localized hotspots on a chip surface.
Ultra-Thin TTV – Down to 0.6 mm thickness with advanced ceramic substrates (e.g., AlN) to replicate high power density (up to 1925 W/cm²).
A TTE is a rack-level thermal emulator, combining multiple TTVs to simulate entire boards or server racks. This allows validation of cooling systems such as immersion tanks, liquid cooling, CDUs, and cold plates at rack power levels up to 300,000 W.
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Super High Power TTV |
Super High Power TTV |
Super High Power TTV |
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TTV |
TTE |
TTE |
A TTV (Thermal Test Vehicle) is a simulation device that mimics the thermal behavior of high-power electronics such as CPUs, GPUs, and AI chips. It allows engineers to test and optimize cooling systems under realistic heat loads without using actual components.
Our Super High-Power TTV modules can simulate power densities up to 500 W/cm², ideal for testing thermal management systems in AI servers, HPC devices, and OAM modules.
TTV modules are compatible with a wide range of cooling solutions, including:
Yes. Our TTV modules feature integrated temperature sensors and support real-time feedback and control, allowing precise temperature management and automatic test interruption if overheating is detected.
Absolutely. TTVs are ideal for simulating heat loads when designing or validating cold plates, heat sinks, and liquid cooling loops — helping shorten development cycles and ensure performance reliability.
Yes, we provide custom TTV modules tailored to specific form factors, power requirements, or interface types. Contact our engineering team for design consultation.
