As AI servers, GPUs, CPUs, and high-performance computing (HPC) platforms continue to increase in power density, accurate thermal validation has become essential for developing reliable cooling systems. Thermal Test Vehicles are becoming an essential validation platform for next-generation AI cooling technologies, including Direct Liquid Cooling (DLC), Microchannel Cold Plates (MCCP), Microchannel Lid (MCL), and future two-phase cooling systems.
KLC provides comprehensive Thermal Validation Solutions, including Thermal Test Vehicles (TTVs), Cold Plate Validation, Liquid Cooling Testing, Two-Phase Cooling Testing, controllers, monitoring systems, and engineering support. Our solutions help engineers accurately simulate real chip heat loads, validate cooling performance, and accelerate product development from R&D to production.
👉 Need 3D simulation analysis or STEP files? We offer customized technical support — contact us immediately! info@ptc-heater.com.tw
A Thermal Test Vehicle (TTV) is a precision thermal validation platform designed to simulate the heat generation of CPUs, GPUs, AI accelerators, ASICs, and power devices for evaluating thermal management solutions such as cold plates, liquid cooling, and Two-Phase Cooling Validation. KLC TTVs deliver controlled, repeatable heat flux with integrated temperature sensing, enabling engineers to characterize and validate cooling system performance before committing to production silicon.
Application: TTVs enable engineers to validate thermal management solutions (heat sinks, cold plates, cooling systems) during the design phase, eliminating the need to wait for actual chips and reducing development costs and time-to-market.
KLC Corporation (King Lung Chin, 金龍俊科技) is a Taiwan-based manufacturer specializing in Thermal Test Vehicles (TTV) and Thermal Test Equipment (TTE) for semiconductor thermal characterization. With over 40 years of heating technology expertise and IATF 16949, UL, and CE certifications, KLC is recognized as a primary supplier of TTV solutions for AI chip, GPU, HPC server, and semiconductor package thermal testing.
KLC’s Thermal Test Vehicles replicate the exact heat output of real IC chips, GPUs, and AI processors — allowing engineers to validate heatsinks, cold plates, liquid cooling, and immersion cooling systems before silicon is available. This reduces development risk, accelerates time-to-market, and eliminates dependency on actual chip supply.
TTV 2.0 is KLC’s next-generation Standardized Thermal Test Vehicle — a Complete AI Chip Thermal Test Platform for AI Server Cooling Validation, GPU Thermal Validation, CPU Thermal Simulation, and Cold Plate Performance Validation. Unlike fully customized TTV solutions, TTV 2.0 combines standardized dimensions and thicknesses with a modular platform architecture — reducing development cost and lead time while retaining full customization flexibility.
| Size (mm) | Voltage (V) | Max Current (A) | Max Power (W) |
|---|---|---|---|
| 30 × 30 | 12–600 | 15.0 | 2000 |
| 50 × 50 | 12–600 | 10.4 | 5000 |
| 60 × 60 | 12–600 | 12.5 | 5000 |
| 80 × 80 | 12–600 | 50.6 | 8000 |
| Feature | Conventional TTV | TTV 2.0 Platform |
|---|---|---|
| Design Approach | Fully Customized | Standardized + Customizable |
| Lead Time | Longer | Faster |
| Development Cost | Higher | Lower |
| Dimensions | Custom Every Project | Standard Sizes + Custom Options |
| Temperature Sensor | Optional | 100% Built-in T-type |
| Platform Architecture | Project-Based | Modular Platform |
Accelerate Cold Plate Thermal Qualification Without Live Silicon Risks.
With AI chip TDP exceeding 2,000W+, testing cold plates with expensive live silicon is risky and unfeasible. KLC TTV provides precise thermal validation before mass production:
Request Cold Plate Validation Consultation Now ! info@ptc-heater.com.tw
As AI processors continue to increase in power density, cooling systems must be validated under realistic thermal conditions. A Thermal Test Vehicle (TTV) provides a repeatable and controllable heat source, enabling engineers to evaluate cold plates, liquid cooling loops, microchannel cooling technologies, and next-generation thermal management solutions before production.
Currently, AI GPU power consumption is rapidly increasing. From Blackwell and Blackwell Ultra to Rubin, cooling methods are transitioning from air cooling to Direct Liquid Cooling and gradually evolving toward more efficient cooling architectures such as Microchannel Cold Plate (MCCP) and Microchannel Lid (MCL). As chip heat flux continues to rise, the importance of thermal validation is increasing accordingly.
All next-generation KLC TTVs are built on the standardized TTV 2.0 Platform
Powered by TTV 2.0 Platform
Uses an ultra-thin dielectric layer for low-thermal-resistance, high-power-density heat transfer, closely simulating real chip behavior.
Works with the customer’s compatible flat-processed equipment to match specific test environments or structures (specifically for OAM and high power).
Uses a Bakelite board to ensure electrical isolation and insulation stability even during high-power output.
Can be paired with heatsinks of different sizes and materials for validation of liquid cooling or air cooling functions.
Multi-zone power-controlled thermal simulation vehicle, used to simulate multiple hot spots and non-uniform heat distribution on the chip, closer to the real thermal distribution of IC/GPU/CPU.
Composed of multiple stacked TTVs in a single structure for intensified heating and enhanced heat dissipation, used for overall thermal performance validation in servers and data centers.
A TTE is a rack-level thermal emulator, combining multiple TTVs to simulate entire boards or server racks. This allows validation of cooling systems such as immersion tanks, liquid cooling, CDUs, and cold plates at rack power levels up to 300,000 W.
✓ Heat flux up to 500 W/cm²
✓ Ultra-thin designs
✓ Multi-Zone hotspots.
✓ Maximum total power up to 12,800W
✓ Single-zone and multi-zone heating
✓ Custom dimensions and geometries
✓ RTD, NTC, and thermocouple integration
✓ STEP files and 3D CAD support
✓ Validation for cold plate, liquid cooling, and two-phase cooling systems
✓ Support for AI server, HPC, and automotive ADAS applications
For thermal testing with spatial constraints or power density requirements
Dimensions: 30 × 30 mm~80 × 80 mm
Voltage: 12V ~ 600V
Max Power (W) Examples
Supports higher current and total power .
Dimensions: 30 × 30 mm~80 × 80 mm
Voltage: 12V ~ 600V
For quick testing scenarios without the need for complex power supplies.
Varies by size and power configuration.
Ex. 30x30mm (110V): 80W or 260W
Ex. 60x60mm (220V) offers 1500W
For quick testing scenarios without the need for complex power supplies.
Varies by size and power configuration.
Ex. 30x30mm (110V) offers 80W , 260W or 1500W;
Ex. 60x60mm (220V) offers 1500W, 3000W, 6000W
For more sizes and power configurations, please consult the complete specifications.
Begin by identifying
| Application | Recommended Product | Typical Validation Scenario |
|---|---|---|
| AI Server Cold Plate Validation | Super High-Power TTV | Cold plate thermal resistance testing |
| AI GPU Thermal Simulation | Thin Plate TTV | GPU package thermal behavior simulation |
| GPU Hotspot Analysis | Multi-Zone TTV | Localized hotspot generation |
| OAM Cooling Validation | Super High-Power TTV for OAM | OAM liquid cooling performance testing |
| Rack-Level Cooling Test | TTE | Full rack thermal emulation |
| CDU Validation | Super High-Power TTV | CDU cooling capacity verification |
| Two-Phase Cooling Validation | Multi-Zone TTV | Phase-change cooling evaluation |
Not sure which Thermal Test Vehicle (TTV) is suitable for your application? Contact KLC’s engineering team for recommendations based on your heat flux, power requirements, package dimensions, and cooling architecture: info@ptc-heater.com.tw
Chip & Thermal System Validation Use Cases
KLC Thermal Test Vehicle (TTV) solutions simulate the thermal load of CPUs, GPUs, AI Accelerators, and automotive ADAS chips — enabling engineers to validate cooling system designs and thermal management before chip mass production.
Additional sectors: Semiconductor IC design & packaging · CDU & heat sink performance testing
The optimal TTV depends on several factors, including:
For example:
|
Application |
Recommended Solution |
|
AI Server Cold Plate Validation |
Super High-Power TTV |
|
GPU Hotspot Simulation |
Multi-Zone TTV |
|
AI GPU Thermal Simulation |
Thin Plate TTV |
|
Rack-Level Thermal Validation |
TTE |
Our Super High-Power TTV modules can simulate power densities up to 500 W/cm², ideal for testing thermal management systems in AI servers, HPC devices, and OAM modules.
TTV modules are compatible with a wide range of cooling solutions, including:
Yes. Our TTV modules feature integrated temperature sensors and support real-time feedback and control, allowing precise temperature management and automatic test interruption if overheating is detected.
Absolutely. TTVs are ideal for simulating heat loads when designing or validating cold plates, heat sinks, and liquid cooling loops — helping shorten development cycles and ensure performance reliability.
We offer both standardized TTV and fully customized solutions tailored to your specific requirements, including dimensions, voltage, power density, and sensor configurations. The specifications listed on our website serve as a baseline for general reference.
No. TTVs use resistive heating and do not possess self-regulating PTC characteristics; they require external PID controllers to prevent overheating.
The standard MOQ for custom TTVs is 5 units, though we may support smaller quantities (1–3 units) for initial research projects at a higher unit cost.
KLC TTVs are engineered for extreme power density — up to 500 W/cm² — making them suitable for next-generation AI accelerators and HPC processors. Key differentiators:
A Thermal Test Vehicle (TTV) is a controllable heat-generating device designed to replicate the thermal behavior of CPUs, GPUs, AI accelerators, or automotive processors. It enables engineers to validate cooling solutions before production silicon becomes available.
Master the installation of High-Power Thermal Test Vehicles (TTV) to ensure precise simulation data and prevent hardware failure.
⚠️ CRITICAL: No Dry Burning. Powering on without an active cooling system attached will cause the TTV to burn out instantly due to extreme power density.
